Parametric Investigation on a Micro-Array Heat Sink with Staggered Trapezoidal Bumps

Abstract

More efficient heat sinks are required due to the rapid increase of power density in microelectronic devices. In this study, a micro-array heat sink with stagger trapezoidal bumps was designed. Numerical simulations for the flow and heat transfer under various conditions were carried out to help us to fully understand the mechanisms of the heat transfer enhancement in such a heat sink. The effects of the structure of the heat sink, parameters of the bumps, and volume fraction of the nanofluid on the performance of heat sink were studied. The results show us that the bumps in the heat sink can result in chaotic convection, interrupting the thermal boundary layer and increasing the cooling area, subsequently improving the heat transfer performance. Furthermore, parametric investigations for trapezoidal bumps were conducted to obtain preferential values for parameters, such as the bump width, fore rake angle of the bump, bump height, and bump pitch.

Enhancing Heat Dissipation in Microchannel Heat Sinks: A Comprehensive Study on Al2O3 Nanoparticle Concentration and Flow Rate Dependencies

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Heat transfer enhancement of Fe 3 O 4 ‐water nanofluid by the thermo‐magnetic convection and thermophorestic effect

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“…For example, an inhomogeneous model was employed to study the thermal performance of MCHS filled with nanofluid. 27 The flow, volume fraction, and physical parameters vary so greatly because of the movement of nanoparticles induced by the Brownian motion temperature gradient, that the heat transfer enhancement of MCHS varies greatly also. Abdi 28 proposed a two-phase model based on the Buongiorno's model, which takes the nanoparticle diffusion due to turbulent eddies and magnetophoresis into account.…”