Parametric modeling study of basic electrodeposition in microvias

Abstract

In this paper, we present the results of a modeling study that investigates the material behavior in the electroplating process for the fabrication of micro-vias into printed circuit boards. The simulations are based on the technique that allows explicit tracking of the interface between the electrolyte and the deposited metal in each time step. The control parameters are the aspect ratio, copper ions concentration and initial current density. The response parameters are the filling time and two filling performance metrics.

Numerical modeling of the electroplating process for microvia fabrication

“…As reported in [9], the EITM has been the core of a parametric study on the influence of three design parameters (aspect ratio, bulk ion concentration and initial current density) on three response parameters (RDT, VF, FT) for a trench with a fixed width.…”