“…Therefore, the generated heat and temperature per unit volume have risen, resulting in a significant reduction in the HFF 33,3 devices' operating efficiency and service life. Therefore, several efficient cooling technologies have been proposed to reduce the temperature of microelectronic devices with high heat flux, such as heat pipe cooling (Narasimha et al, 2010), microchannel cooling (Chein and Chen, 2009), phase-change cooling (Zhao et al, 2020) and jet impingement cooling (Abo-Zahhad et al, 2018). Jet impingement cooling has very high heat and mass transfer rates (Martin, 1977) and has attracted the attention of many scholars.…”