2005
DOI: 10.1016/j.jmatprotec.2005.03.023
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Parametric studies on pulsed near ultraviolet frequency tripled Nd:YAG laser micromachining of sapphire and silicon

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Cited by 66 publications
(34 citation statements)
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“…Table 4. Some physical properties of sapphire, silicon, and Pyrex (Chen & Darling, 2005 In general, the laser ablation rates of sapphire, silicon, and Pyrex micromachined by near UV (355 nm) and mid-UV (266 nm) nanosecond pulsed Nd:YAG lasers, are higher using the 266 nm laser than the 355 nm laser in the absence of plume screening effects. Under those high laser fluency micromachining conditions, non-linear optical phenomena such as multiphoton process become important, and the 266 nm laser (with photon energy = 4.66 eV) has a higher probability to induce photochemical process than the 355 nm laser (with photon energy = 3.50 eV).…”
Section: Discussionmentioning
confidence: 99%
“…Table 4. Some physical properties of sapphire, silicon, and Pyrex (Chen & Darling, 2005 In general, the laser ablation rates of sapphire, silicon, and Pyrex micromachined by near UV (355 nm) and mid-UV (266 nm) nanosecond pulsed Nd:YAG lasers, are higher using the 266 nm laser than the 355 nm laser in the absence of plume screening effects. Under those high laser fluency micromachining conditions, non-linear optical phenomena such as multiphoton process become important, and the 266 nm laser (with photon energy = 4.66 eV) has a higher probability to induce photochemical process than the 355 nm laser (with photon energy = 3.50 eV).…”
Section: Discussionmentioning
confidence: 99%
“…The experimental study of micromachining of sapphire (381 mm) and silicon (533 mm) wafers show that the MRR increases with beam energy density irrespective of machining speed (Fig. 10) [66]. The MRR of mullitealumina ceramic during laser cutting was increased by proper selection of off-axis nozzle angle (optimum value 451) and distance between the impinging point of the gas jet and the laser beam front (optimum value 3 mm) [67].…”
Section: Materials Removal Rate (Mrr)mentioning
confidence: 97%
“…For some of them such as silicon, glass, sapphire, the ultraviolet lasers (UV) were developed in order to increase the material absorption [1,2]. While UV lasers around 350 nm obtained by third harmonic generation (THG) are now commonly used in material processing, deep-UV lasers obtained by fourth harmonic generation (FHG) around 260 nm are still challenging to realize.…”
Section: Introductionmentioning
confidence: 99%