Parametric study for use of stainless steel as a material for thermal shield in PIP2IT transferline at Fermilab

Rane, Tejas; Chakravarty, Anindya; Klebaner, Arkadiy

doi:10.1088/1757-899x/278/1/012200

Cited by 1 publication

(1 citation statement)

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“…Heat shields were made from stainless steel sheet metal due to their reflectivity, emissivity, thermal conductivity, and specific heat capacity 24 . It is also cost-effective, durable, and adaptable to customization 25 . Three types of heat shield placement locations were used: sample X using individual heat shield placement on adjacent components of the rework location, as shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

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Section: Methodsmentioning

confidence: 99%