Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules

Sprenger, Mario; Noll, Niklas; Hecht, C.; Greiff, Malte de; Müller, Lars; Franke, Jörg

doi:10.1109/eptc56328.2022.10013218

Cited by 2 publications

(2 citation statements)

References 13 publications

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“…The encapsulant's coefficient of thermal expansion (CTE) should be matched as closely as possible to the other module components (i.e. devices, die attach, substrate) as CTE mismatch is the primary source of thermo-mechanical stresses in a package when operating at elevated temperatures [13]. It has also been demonstrated that having an elastic modulus between 4-10 GPa, which is higher than typical epoxies and gels and similar to that of many resin materials, can be beneficial in increasing the reliability of both conventional and DSC packaging configurations [14], [15].…”

Section: A Requirements and Considerationsmentioning

confidence: 99%

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Lyon,

DiMarino

2023

IMAPSource Proceedings

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With the advent of ultra-wide bandgap (UWBG) semiconductor materials, such as Gallium Oxide (Ga2O3) and Aluminum Nitride (AlN), higher temperature and higher voltage operation of power devices is becoming realizable. However, conventional polymeric and organic encapsulant materials are typically limited to operating temperatures of 200 °C and below. In this work, six materials were identified and evaluated as candidates for use as encapsulants for operation and high-voltage insulation at and above 250 °C. High-temperature silicone gel was used as a reference material and was compared to five novel encapsulants including an epoxy resin, a hydro-set cement, two low melting point glass compounds, and a ceramic potting compound. Gas pycnometry was utilized to evaluate the voiding concentration to avoid partial discharge. Each material was then processed onto a direct-bonded-aluminum (DBA) substrate test coupon to evaluate compatibility with a commonly used metal-ceramic substrate and processability for use in a power module. The insulation capability of each material was evaluated by testing the partial discharge inception voltage (PDIV) across a 1mm gap etched in the substrate. The dielectric stability was then tested by soaking the materials in air at 250 °C for various intervals and observing the degradation of their PDIVs and appearances. The results of each test were compared, and conclusions were drawn about each material’s feasibility for use as a dielectric encapsulation material for a power module operating at temperatures exceeding 200 °C.

show abstract

Section: A Requirements and Considerationsmentioning

confidence: 99%

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Lyon,

DiMarino

2023

IMAPSource Proceedings

View full text Add to dashboard Cite

show abstract

“…The encapsulant's coefficient of thermal expansion (CTE) should be matched as closely as possible to the other module components (i.e., devices, die attach, and substrate) as CTE mismatch is the primary source of thermo-mechanical stresses in a package when operating at elevated temperatures [13]. It has also been demonstrated that having an elastic modulus between 4 and 10 GPa, which is higher than typical epoxies and gels and similar to that of many resin materials, can be beneficial in increasing the reliability of both conventional and DSC packaging configurations [14,15].…”

Section: A Requirements and Considerationsmentioning

confidence: 99%

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Lyon,

DiMarino

2023

Journal of Microelectronics and Electronic Packaging

View full text Add to dashboard Cite

With the advent of ultra-wide bandgap semiconductor materials, such as gallium oxide (Ga2O3) and aluminum nitride (AlN), higher temperature and higher voltage operation of power devices are becoming realizable. However, conventional polymeric and organic encapsulant materials are typically limited to operating temperatures of 200 degrees C and below. In this work, six materials were identified and evaluated as candidates for use as encapsulants for operation and high-voltage insulation at and above 250 degrees C. High-temperature silicone gel was used as a reference material and was compared with five novel encapsulants including an epoxy resin, a hydro-set cement, two low-melting point glass compounds, and a ceramic potting compound. Gas pycnometry was utilized to evaluate the voiding concentration to avoid partial discharge. Each material was then processed onto a direct-bonded-aluminum substrate test coupon to evaluate compatibility with a commonly used metal-ceramic substrate and processability for use in a power module. The insulation capability of each material was evaluated by testing the partial discharge inception voltage (PDIV) across a 1-mm gap etched in the substrate. The dielectric stability was then tested by soaking the materials in air at 250 degrees C for various intervals and observing the degradation of their PDIVs and appearances. The results of each test were compared, and conclusions were drawn about each material’s feasibility for use as a dielectric encapsulation material for a power module operating at temperatures exceeding 200 degrees C.

show abstract

Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules

Cited by 2 publications

References 13 publications

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

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