interfacial forces, [6][7][8] surface modifications, [9,10] as well as well-controlled external fields [11][12][13][14][15] have been adopted, which yield vast types of complex yet delicate particle structures with outstanding functionalities. By virtue of interfacial forces, fluid-interface-assisted self-assembly (or self-organization) has been proven to be a simple yet powerful method. [6,7,11,[16][17][18][19][20][21][22][23] Although self-assembled particle structures are stable at the confining template, losing interfacial confinements causes immediate breakdown because the particles are not physically connected. For limited types of particles, for instance polymeric particles, a sintering process at elevated temperature has been performed for stabilization purpose. [17][18][19][20] Metal particles represent another important group of particle materials that offer numerous editable properties stemming from both the diversity of metals and their hierarchical size effects. High-melting-point metal particles can only be molded at exceedingly high temperatures through methods such as laser or electron-beam-assisted additive manufacturing [24] and liquid phase sintering. [25] Although highenergy methods are able to construct large-scale, high-strength objects, they are not feasible for micro/nanoscale fabrication due to their precision limitation and the requirement for highenergy source. Significant effort has been devoted to exploring methods for low-temperature fabrication of metal nanostructures. [26][27][28][29][30][31] Fluid-interface-assisted fabrication still remains as one of the few, if not the only, available methods to fabricate multi-scale well-designed structures out of metal particles. [32][33][34][35] Unfortunately, interfacial metal particles cannot be sintered under moderate temperature range due to their intrinsic highmelting metallic nature.To address this challenge, here we propose a particle cross-linking strategy that can stabilize interfacial metal particle structures at room temperature. We show that discrete copper nanoparticles (Cu NPs) can be cross-linked to form continuous porous phases at a liquid metal (LM)-electrolyte template, which is electrochemically reducing. In reminiscence of the high-energy metallurgical welding, we call this in-solution particle cross-linking process "electrochemical welding". We conduct surface composition analyses to clarify the underlying mechanisms. We also characterize the mechanical properties and the electrical properties Manipulating particles using a fluid interface has both fundamental implications and technological promises. However, the stabilization of interfacial particle structures remains challenging. This study proposes a room-temperature particle cross-linking strategy achieved by introducing a surface transition process to metal particles confined at a liquid metal-electrolyte template, which is electrochemically reducing. The method enables cross-linking Cu nanoparticles into nanoporous networks of micrometric thickness. It is shown that...