2021
DOI: 10.1016/j.jlumin.2020.117782
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Particle based investigation of self-heating effect of phosphor particles in phosphor converted light emitting diodes

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Cited by 10 publications
(1 citation statement)
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“…Junction temperature ( T j ) is the largest recommended operating temperature in an electronic structure, which is shown in the thermal resistance network in Figure 1 b. As indicated by the heat generating zones (1 to 3) in the thermal resistance map of a typical LED in Figure 1 b, heat is being generated in an LED at (1) the active region due to non-radiative recombination, inside of the optical cavity due to radiation absorption, electrical structures and semiconductor metal interfaces due to Joule heating [ 22 ], (2) phosphor–polymer composite/coating in a white LED due to Stokes shift and thermal quenching of phosphor [ 23 , 24 , 25 , 26 , 27 ], and (3) outside of the optical cavity due to the radiation absorption and other electrical structures due Joule heating [ 28 , 29 ]. Currently, chip on board, wafer level, and chip-scale packaging are the most popular designs in the LED market for heat dissipation [ 30 ].…”
Section: Introductionmentioning
confidence: 99%
“…Junction temperature ( T j ) is the largest recommended operating temperature in an electronic structure, which is shown in the thermal resistance network in Figure 1 b. As indicated by the heat generating zones (1 to 3) in the thermal resistance map of a typical LED in Figure 1 b, heat is being generated in an LED at (1) the active region due to non-radiative recombination, inside of the optical cavity due to radiation absorption, electrical structures and semiconductor metal interfaces due to Joule heating [ 22 ], (2) phosphor–polymer composite/coating in a white LED due to Stokes shift and thermal quenching of phosphor [ 23 , 24 , 25 , 26 , 27 ], and (3) outside of the optical cavity due to the radiation absorption and other electrical structures due Joule heating [ 28 , 29 ]. Currently, chip on board, wafer level, and chip-scale packaging are the most popular designs in the LED market for heat dissipation [ 30 ].…”
Section: Introductionmentioning
confidence: 99%