Parylene Interposer as Thin Flexible 3-D Packaging Enabler for Wireless Applications

Abstract

This paper presents a novel, all-Parylene, thin, flexible 3-D packaging technology with an application demonstration of wireless powering. Parylene is utilized as a base substrate of a packaging interposer, and multilayer thin films are conformally stacked on the Parylene substrate. High-density (450 pF/mm 2 ) metal-insulator-metal capacitors are implemented with an ultrathin ( 47 nm) deposition of Parylene-N. The energy storage capabilities as well as RF characteristics are characterized. To demonstrate interposer applicability, an RF energy-harvesting study is performed by implementing a rectifier circuit on the Parylene interposer utilizing embedded capacitors of wide-ranging values and an antenna. Finally, substrate folding tests are performed to verify the applicability of the Parylene interposer in a flexible form factor without undergoing degradation in energy-harvesting capability. The thin-film flexible capacitors are demonstrated to not short-circuit even under the stress of folding the interposer.

Parylene coated waterproof washable inkjet-printed dual-band antenna on paper substrate

“…In addition, Parylene is a flexible material since it has low Young's modulus of 2.76 GPa. This value is close to that of PET which is well known and widely used as a flexible substrate (2.0 ~ 2.7 GPa) [8]. Therefore, the Parylene material has a great potential to be used for the environmental protection and sealing of flexible radio-frequency (RF) devices and circuits.…”

A Miniaturized, Eye-Conformable, and Long-Term Reliable Retinal Prosthesis Using Monolithic Fabrication of Liquid Crystal Polymer (LCP)

“…Recently polymer-based implantable devices have been widely investigated using biocompatible materials such as polyimide, parylene, silicone rubbers for flexibility, lightness, miniaturization, and compatibility with a low cost batch-process [24][25][26][27][28][29][30][31][32][33][34][35][36].…”

Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)

“…There is a lengthy history of research into semi-rigid polymers or soft conformal organic coatings such as by PDMS, parylene, polyimide and liquid crystal polymer. [10][11][12][13][14][15][16][17] Recently, thin film inorganic materials based on various oxides beginning with bare SiO 2 have made inroads as prospective candidates for hermetic seals specifically of small scale silicon-based implants. [18] Microscale implantable devices for the nervous system are the primary application of interest in the authors" laboratories, and for a broad overview specifically of the state-of-the-art in neural interfaces [19] .…”