2020
DOI: 10.1016/j.mee.2020.111315
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Passivated electrode side walls by atomic layer deposition on flexible polyimide based samples

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Cited by 7 publications
(7 citation statements)
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“…As the development of miniaturized structures progresses to the nanoscale, further innovative passivation coatings need to be considered. Thin-film metal oxide coatings applied by Atomic Layer Deposition (ALD) are gaining attention as ultrathin conformal coatings with high barrier properties [79][80][81] .…”
Section: Optical and Electrical Characterization Of The 3d Microelect...mentioning
confidence: 99%
“…As the development of miniaturized structures progresses to the nanoscale, further innovative passivation coatings need to be considered. Thin-film metal oxide coatings applied by Atomic Layer Deposition (ALD) are gaining attention as ultrathin conformal coatings with high barrier properties [79][80][81] .…”
Section: Optical and Electrical Characterization Of The 3d Microelect...mentioning
confidence: 99%
“…Hard etch masks are required for this dry etch process, as thin photoresist layers lack the etch selectivity required to allow the polyimide layer to be etched before the mask itself is etched away completely. Examples of etch mask materials include aluminium [53], chromium [54], titanium [50], nickel [55] and gold [56], although in some cases thick photoresist may also be used.…”
Section: Polymer Patterningmentioning
confidence: 99%
“…Titanium dioxide was formed using a titanium tetraisopropoxide (TTIP) precursor (abcer GmbH, AB 113507) at 100 • C at a thickness of 15 and 30 nm. The deposition process is based on previous work (Potts et al, 2010;Westerhausen et al, 2020).…”
Section: Microelectrode Arraysmentioning
confidence: 99%