1992
DOI: 10.1063/1.350765
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Passivation of copper by silicide formation in dilute silane

Abstract: The formation of copper silicide by reaction of silane with sputtered copper films has been observed at temperatures as low as 300 °C. The growth kinetics have been monitored by both sheet resistance and x-ray diffraction techniques. Cu5Si is the first phase to form followed next by Cu3Si, coincident with the loss of the original copper layer. The silicide layer provides significant oxidation protection for the underlying copper up to 550 °C in air.

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Cited by 68 publications
(27 citation statements)
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“…At temperatures below the pyrolysis, silane is known to catalytically decompose only at the surface of the metal. 30 The CVD runs were realized at temperatures between 600 and 650°C for a duration of 15 min, giving rise to NWs of several microns in length. More details on NW synthesis can be found elsewhere.…”
Section: Methodsmentioning
confidence: 99%
“…At temperatures below the pyrolysis, silane is known to catalytically decompose only at the surface of the metal. 30 The CVD runs were realized at temperatures between 600 and 650°C for a duration of 15 min, giving rise to NWs of several microns in length. More details on NW synthesis can be found elsewhere.…”
Section: Methodsmentioning
confidence: 99%
“…Numerous solid state experimental techniques have been implemented to detect metal silicides and determine their properties, such as (Schottky) barrier heights and contact resistances. [28,29] Knowledge of the growth pattern of coinage metal−doped Si clusters will improve understanding of the formation mechanisms and associated properties of those silicides. For SinCu + (n = 6−11), it is found that the Cu atom prefers to cap either a face or edge of the ground state structure of the parent bare Sin + or Sin cluster.…”
Section: Introductionmentioning
confidence: 99%
“…(3) A copper-silicide protective layer was formed by reacting silane with copper film [11]. Copper thin film reacts with 2% SiH 4 /N 2 at various temperatures and holding times to form metal-silicides (Cu 5 Si 3 or Cu 3 Si).…”
Section: Introductionmentioning
confidence: 99%