Passive thermal management of tablet PCs using phase change materials: Continuous operation

Ahmed, Tousif; Bhouri, Maha; Groulx, Dominic; White, Mary Anne

doi:10.1016/j.ijthermalsci.2018.08.010

Cited by 33 publications

(25 citation statements)

References 19 publications

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“…Though these studies introduce the pathways to evaluate thermal performance of PCM TES units under intermittent operation, there are no standalone published studies looking at the in-depth intermittent operation of thin PCM TES units incorporated into realistic tablet PCs. The performance of recently developed slim PCM TES units by the current authors [15] has not been reported under any intermittent type usage situations yet.…”

Section: Introductionmentioning

confidence: 83%

“…The authors concluded that PCMs with melting temperatures below 39 • C are most suitable for thermal management of tablet PCs. In a previous study presenting the first approach to the current work, i.e., testing under continuous operation [15], PCM TES unit implementation issues in a real tablet PC were worked out and presented, and experimental results showed that under continuous operation (60 min of continuous heating at 2 W, 4 W, 6 W or 8 W), the temperatures of both the system on a chip (SOC) and the cover were reduced compared to the case without PCM.…”

Section: Introductionmentioning

confidence: 99%

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Passive Thermal Management of Tablet PCs Using Phase Change Materials: Intermittent Operation

et al. 2019

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This paper presents an experimental study of thermal management in a tablet PC under intermittent operation, with phase change materials (PCMs) encapsulated in a very thin aluminized laminate film container. It complements a study of the same system under continuous operation that was published in 2018. Two different types of PCMs were used for the experimental work; PT-37 and n-eicosane. A commercially available tablet PC was used as a test subject to ensure representative dimensions and material properties of every intricate part of the real tablet PC. For intermittent operation, the cycle used corresponds to fifteen minutes of operation (heat generation) followed by fifteen minutes of rest, to imitate a regular usage pattern of a tablet PC. It was observed that thin PCM thermal energy storage (TES) units are capable of providing a reduction in the rate of temperature increase during transient operations for both the electronics and the tablet cover. Reduction in peak temperature of the heat source and external surfaces of the tablet PC was also observed. At the maximum of 8 W operating power, PCMs were able to reduce the back-cover temperature by 20 °C. At all power inputs, heat storage in PCMs resulted in back-cover temperatures lower than 40 °C. Moreover, it was found that the PCM thermal management system tested was not affected by the inclination of the tablet PC. Results obtained from this study confirm that thin PCM encapsulation is indeed a suitable solution to control the temperature in tablet PCs during intermittent operation.

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Section: Introductionmentioning

confidence: 83%

Section: Introductionmentioning

confidence: 99%

Passive Thermal Management of Tablet PCs Using Phase Change Materials: Intermittent Operation

et al. 2019

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“…An interesting approach that could lead to a reduction of peak temperatures and therefore increased time of operation of electronic components is based on phase change materials (PCMs) integration into the design of tablets [10][11][12]. Typically, portable electronic devices operate in transient cycles, meaning that heat is produced during short periods of demanding use, followed by longer periods of idling or less demanding use.…”

Section: Introductionmentioning

confidence: 99%

“…However, a small number of investigations with the aim of using PCM as part of the thermal management system of thin electronic devices (overall thickness in the range of 15 mm or smaller) have been published [10][11][12][25][26][27][28][29][30], and those are of great interest to the field of study and this work specifically. Numerical investigation on the thermal management of a modern computer tablet including thin PCM layers (0.5 mm) was performed by Sponagle and Groulx [11].…”

Section: Introductionmentioning

confidence: 99%

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Experimental Investigation of Thin PCM Packages and Thermal Spreader for Thermal Management of Portable Electronic Devices

et al. 2019

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As the size of portable electronic devices, like tablet computers or smartphones, continues to decrease and their performance continues to increase, thermal management of the generated heat is becoming an ever more important issue. Phase change materials (PCMs) integration is a promising approach to reduce overheating of electronic components in tablet design while keeping the temperature of the cover surface within a comfortable range. This work focuses on the experimental thermal investigation of thin encapsulated PCM packages in combination with a thermal spreader as a solution for thermal management in portable electronic devices. The packages had an overall thickness of less than 2 mm in order to meet the requirements for integration in thin portable electronic devices. A simplified setup at a scale similar to a modern tablet computer was used for the experimental investigations. Experiments were conducted to study, for the first time, the local thermal behavior of the thin packages and their influence on the temperature increase of the heat source and cover surface. Two different PCMs were tested: n-eicosane and dodecanoic acid. An aluminum sheet with a thickness of 0.4 mm was used as a thermal spreader. It was determined that the combination of a spreader and the thin PCM packages led to substantial reduction of the temperature increase of both the heater and the cover. Compared to the case where neither a spreader nor a PCM package was used, the heater and cover maximum temperatures were reduced by 45% and 42%, respectively, when a constant heat power input of 5 W for 60 min was applied.

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Phase‐change composites silicone rubber/paraffin@SiO₂ microcapsules with different core/shell ratio for thermal management

Deng

Yang

Cai

et al. 2021

Intl J of Energy Research

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A series of paraffin (Pa)@silicon dioxide (SiO 2 ) microcapsules with different core/shell ratios were constructed by interfacial-polycondensation of tetraethoxysilane (TEOS) and γ-Methacryloxypropyltrimethoxysilane (MPS), and then were embedded in addition-cure liquid silicone rubber (ALSR) to fabricate ALSR/Pa@SiO 2 phase-change composites. The SiO 2 shell can avoid the leakage of Pa. Meanwhile, the in-situ modification of the SiO 2 shell by MPS can enhance the interface bonding between Pa@SiO 2 and ALSR, because the C═C bond introduced by MPS on the SiO 2 shell can participate in the curing reaction of ALSR. The study explored the effects of the core/shell ratio on the Pa@SiO 2 microcapsules and ALSR/Pa@SiO 2 composites. Differential scanning calorimetry analysis demonstrated that ALSR/Pa@SiO 2 composites have dependable thermal energy storage capability which can reach to 90.7 J g À1 and phase-change enthalpy of the composites increase with the core/shell ratio. The ALSR/Pa@SiO 2 composites were found as form-stable phase-change materials with low leakage rate, which is attributed to the protection of both SiO 2 shell and ALSR matrix. Due to the chemical interfacial interaction, the composites displayed improved mechanical strength. The composites can be used for thermal management and temperature regulation as an electronic packaging material. K E Y W O R D Saddition-cure liquid silicon rubber, core/shell ratio, electronic packaging, paraffin@SiO 2 microcapsules, thermal management

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Passive thermal management of tablet PCs using phase change materials: Continuous operation

Cited by 33 publications

References 19 publications

Passive Thermal Management of Tablet PCs Using Phase Change Materials: Intermittent Operation

Passive Thermal Management of Tablet PCs Using Phase Change Materials: Intermittent Operation

Experimental Investigation of Thin PCM Packages and Thermal Spreader for Thermal Management of Portable Electronic Devices

Phase‐change composites silicone rubber/paraffin@SiO₂ microcapsules with different core/shell ratio for thermal management

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Passive thermal management of tablet PCs using phase change materials: Continuous operation

Cited by 33 publications

References 19 publications

Passive Thermal Management of Tablet PCs Using Phase Change Materials: Intermittent Operation

Passive Thermal Management of Tablet PCs Using Phase Change Materials: Intermittent Operation

Experimental Investigation of Thin PCM Packages and Thermal Spreader for Thermal Management of Portable Electronic Devices

Phase‐change composites silicone rubber/paraffin@SiO2 microcapsules with different core/shell ratio for thermal management

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Product

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Phase‐change composites silicone rubber/paraffin@SiO₂ microcapsules with different core/shell ratio for thermal management