“…The rapid development of flexible electronics in the past decade has enabled a wide variety of emerging applications ranging from a soft humanâmachine interface, electronic skin, â energy, , and implantable bioelectronics to flexible and stretchable displays â and smart wearables. â Because flexible devices are highly deformable, materials in these devices experience different degrees of tensile strains during the bending, stretching, compressing, and twisting of the devices. , While polymeric substrates used for fabricating the devices are often compliant enough, other materials such as metals, inorganic semiconductors, and ceramics are too brittle to withstand the tensile strains. Unfortunately, despite the intensive effort to develop various types of soft materials in the past decades, these brittle materials are still indispensable in most device applications. â For example, a metal is widely used as the electrode, interconnect, lead, and contact in flexible electronics due to the intrinsically high conductivity and excellent compatibility with conventional manufacturing processes .…”