2021 International Workshop on Advanced Patterning Solutions (IWAPS) 2021
DOI: 10.1109/iwaps54037.2021.9671058
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Pattern Centric Machine Learning Approach to Uncover Process Defects During Wafer Inspection and Review

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“…Finding real defects on a wafer is becoming more challenging and costly, especially in advanced nodes [1,2] . Often, there are a lot of nuisances (false) defects detected and they make root cause analysis more difficult [3,4,5] and time consuming. To determine the impact of fluctuations in process conditions between wafers, the exposure energy and focus can be changed on the same wafer, and then a defect detection/filtering method is used to determine the optimal process conditions [6] .…”
Section: Introductionmentioning
confidence: 99%
“…Finding real defects on a wafer is becoming more challenging and costly, especially in advanced nodes [1,2] . Often, there are a lot of nuisances (false) defects detected and they make root cause analysis more difficult [3,4,5] and time consuming. To determine the impact of fluctuations in process conditions between wafers, the exposure energy and focus can be changed on the same wafer, and then a defect detection/filtering method is used to determine the optimal process conditions [6] .…”
Section: Introductionmentioning
confidence: 99%