2001
DOI: 10.1088/0957-4484/12/2/321
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Pattern formation in hot embossing of thin polymer films

Abstract: We have investigated pattern formation of thin PMMA films during both hot embossing and demoulding of micro- and nanostructures. During filling of the stamp cavities, compressive and capillary effects were observed, and under certain conditions periodic patterns with characteristic length scales formed. In unstructured stamp regions the form of these patterns is affected by local differences in the pressure. For structured stamps, the self-assembly is strongly influenced by the size and the shape of the stamp … Show more

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Cited by 128 publications
(98 citation statements)
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“…Solution processing allows more flexibility for OLED implementation and design as with imprinting lithography, a promising lithographical technique that allows for an easy, cheap, and high resolution patterning of organic devices. 26,27 In this letter, we report photoluminescence characterization of ErQ 3 spin-coated sample demonstrating that the advantageous properties of this compound, i.e., wide absorption band and third window luminescence, are preserved by this deposition technique. A solution was prepared by dissolving ErQ 3 powder in dimethyl sulfoxide ͑DMSO͒ ͑Sigma-Aldrich͒, that was experimented to be the most effective solvent for ErQ 3 .…”
mentioning
confidence: 85%
“…Solution processing allows more flexibility for OLED implementation and design as with imprinting lithography, a promising lithographical technique that allows for an easy, cheap, and high resolution patterning of organic devices. 26,27 In this letter, we report photoluminescence characterization of ErQ 3 spin-coated sample demonstrating that the advantageous properties of this compound, i.e., wide absorption band and third window luminescence, are preserved by this deposition technique. A solution was prepared by dissolving ErQ 3 powder in dimethyl sulfoxide ͑DMSO͒ ͑Sigma-Aldrich͒, that was experimented to be the most effective solvent for ErQ 3 .…”
mentioning
confidence: 85%
“…Once the temperature in the film has been lowered to well below its glass transition temperature (40ºC or more below) it is lifted off the embossing roll. [18,33,36,37] This project has been split into three phases: Machine Design, Mold Design, and…”
Section: Introductionmentioning
confidence: 99%
“…The problems are associated with the residual layer thickness under the stamp protrusions and incomplete filling of large cavities in the stamp. 21,22 A residual layer of the polymer is always remaining on the substrate after imprinting, and the polymer flow decreases rapidly when the residual film thickness decreases.…”
Section: Introductionmentioning
confidence: 99%