Pattern transition from dense branching morphology to fractal for copper and β′ brass electrodeposition in thin gap geometry

Abstract

The Dielectric Breakdown Model applied to explain various morphologies of deposited metallic structures in thin gap metal electro-deposition AIP Advances 5, 067120 (2015); https://doi

Effect of free energy barrier on pattern transition in 2D diffusion limited aggregation morphology of electrodeposited copper

“…It was reported [5] that fractal dimension for fractal like growth during copper electrodeposition decreases with increasing electric field and molarity, but interestingly it follows an inverse relation below 6 V. We perform similar experiment again and found the transition voltage to be 6 V. In this article, we report on how temperature affects the deposition process and then the microscopic physical mechanism will be discussed in order to explain the morphological transition.…”

“…Systems like Ni-Cu and Co-Cu involving copper have also been studied extensively [2, 3]. During electrochemical deposition of the copper films, fractal-like patterns have been observed by many authors [4, 5]. Thus, the growth of such ultrathin 2D like copper film is a very interesting field in understanding the underlying ion dynamics.…”

“…Therefore, the theoretical and experimental works have been largely confined to finding those parametric dependencies [13]. It has been hypothesized [5] that if the problem of morphological transition during electrodeposition is seen in momentum space with ionic velocity driven by thermal and electric fields, the experimental results can then be explained satisfactorily. Though great qualitative insight has been gained from these studies, but still many questions on how the morphological transitions change with temperature remains less explored.…”

Myelin surfactant assemblies shaping the electrodeposition of copper dendrites.

“…For example, with a 2 µL source droplet containing 18.5 mol% CuCl 2 , the upper limit to the copper(II) concentration, upon complete release of Cu 2+ to the aqueous phase, equals 200 µM. This concentration is well below the copper(II) concentrations that are typically used for electrodeposition studies of dense copper fractals [43][44][45] . Therefore, we first study the electrochemical deposition of copper dendrites from aqueous CuCl 2 solutions with concentrations between 10 μM and 1 mM.…”

“…Here, we establish a dynamic molecular system that exploits the growth of myelin assemblies floating over an aqueous medium to guide the electrodeposition of copper dendrites by the transport of copper(II) (Cu 2+ ) ions. Without the guiding element, the reduction of copper(II) from an aqueous solution results in a radial growth of dendritic structures from the surface of the cathode [40][41][42][43][44][45] . Due to their conductivity, these wires are repelled from the negative electrode and grow towards the Cu 2+ -rich medium upon electrodeposition at their tips -a combination of reaction, diffusion and electrostatics that provides these so-called dendrites with a fractal-like morphology.…”