Patterned nickel interlayers for enhanced silver wetting, spreading and adhesion on ceramic substrates

Hu, Genzhi; Zhou, Quan; Bhatlawande, Aishwarya; Park, Jiyun; Termuhlen, Robert; Ma, Yuxi; Bieler, T. R.; Yu, Hui-Chia; Qi, Yue; Hogan, Timothy P.; Nicholas, Jason D.

doi:10.1016/j.scriptamat.2021.113767

Cited by 9 publications

(6 citation statements)

References 45 publications

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“…Ag:Ni contacts were fabricated using methods described previously (17). First, nickel inks were screen printed onto either sapphire substrates (for sheet resistivity measurements) or lanthanum strontium manganite (LSM) substrates (for contact resistivity measurements).…”

Section: Sample Fabricationmentioning

confidence: 99%

“…In these applications, electrical contacts with low electronic sheet resistance, low electronic contact resistance, and high adhesion strength are desired. Recently, a new Particle-Interlayer-Directed Wetting and Spreading (PIDWAS) technique has been developed that utilizes a) the low wetting angle of silver on nickel (10,11), and b) the high work of adhesion between nickel and various oxides (12), to fabricate well-adhered silver patterns on substrates not normally wet by silver (5,(13)(14)(15)(16)(17)(18). However, the full electrical performance (i.e.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Temperature-Dependent Sheet and Contact Resistivity Measurements on Ag and Ag-Ni Circuit Pastes

Bhatlawande¹,

Hu²,

Nicholas³

et al. 2023

ECS Trans.

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Here, a van der Pauw method was used to compare the 25-450oC sheet resistivity of Ag-Ni electrical contacts to those made from commercially-available Heraeus C8710 and DAD-87 silver circuit pastes. In addition, a circular transfer length method was used to compare the 25-600oC contact resistivity of Ag-Ni, Heraeus C8710, and DAD-87 on lanthanum strontium manganate (LSM). After 10 hours at 750oC in air, the Ag-Ni sheet resistivity was nearly double that of the commercial Ag pastes. However, after 10 hours at 750oC in air, the Ag-Ni to LSM contact resistivity was between that of Heraeus C8710 and DAD-87. The low Ag-Ni sheet resistivity of ~10-6 ohm-cm, the low Ag-Ni to LSM contact resistivity of ~10-4 ohm-cm2, and the previously-observed >10 times higher adhesion strength of Ag-Ni (compared to Heraeus C8710 or DAD-87) on ceramic substrates, suggests that Ag-Ni may be useful for a variety of high-temperature electronic circuit/current collector applications.

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Section: Sample Fabricationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Temperature-Dependent Sheet and Contact Resistivity Measurements on Ag and Ag-Ni Circuit Pastes

Bhatlawande¹,

Hu²,

Nicholas³

et al. 2023

ECS Trans.

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show abstract

“…Most of the Ag ows away from the gap between YSZ and AISI 441, and only a slight residual Ag exists between YSZ and AISI 441. This phenomenon can be attributed to the high contact angle of pure Ag on the YSZ surface and no reaction between YSZ and Ag, resulting in the loss of liquid Ag during joining [34,44].…”

Section: Effect Of Bonding Temperature On Ysz/aisi 441 Jointmentioning

confidence: 99%

Joining YSZ electrolyte to AISI 441 interconnect for solid oxide cells using the Ag interlayer: Enhanced mechanical and aging properties

Wang

et al. 2021

Preprint

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Conventional Ag-CuO braze can lead to two electrolyte/interconnect joining issues: over-oxidation at the steel interconnect and hydrogen-induced decomposition of CuO. This work demonstrates that a pure Ag interlayer, instead of Ag-CuO braze, can join YSZ electrolyte to AISI 441 interconnect in air. Reliable joining between YSZ and AISI 441 can be realized at 920 °C. A dense and thin oxide layer (~2 μm) is formed at the AISI 441 interface. Also, an interatomic joining at the YSZ/Ag interface is detected by TEM observation. Obtained joints display high shear strengths (~86.1 MPa), 161% higher than that of joints brazed by Ag-CuO braze (~33 MPa). After aging in reducing and oxidizing atmospheres (800 °C/300 h), joints remain tight and dense, indicating a better aging performance. This technique eliminates the CuO-induced issues, which will extend lifetimes for SOFC/SOEC stacks and other ceramic/metal joining applications.

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“…Most Ag flowed away from the gap between YSZ and AISI 441, and only a slight residual Ag existed between YSZ and AISI 441. This phenomenon can be attributed to the high contact angle of pure Ag on the YSZ surface and no reaction between YSZ and Ag, resulting in the loss of liquid Ag during sintering [39,58].…”

Section: Shear Strength Of Joints At Various Joining Temperaturesmentioning

confidence: 99%

Joining 3YSZ Electrolyte to AISI 441 Interconnect Using the Ag Particle Interlayer: Enhanced Mechanical and Aging Properties

Wang

et al. 2021

Crystals

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Reactive air brazing has been widely used in fabricating solid oxide fuel/electrolysis cell (SOFC/SOEC) stacks. However, the conventional Ag–CuO braze can lead to (I) over oxidation at the steel interconnect interface caused by its adverse reactions with the CuO and (II) many voids caused by the hydrogen-induced decomposition of CuO. The present work demonstrates that the Ag particle interlayer can be used to join yttria-stabilized zirconia (YSZ) electrolytes to AISI 441 interconnect in air instead of Ag–CuO braze. Reliable joining between YSZ and AISI 441 can be realized at 920 °C. A dense and thin oxide layer (~2 μm) is formed at the AISI 441 interface. Additionally, an interatomic joining at the YSZ/Ag interface was observed by TEM. Obtained joints displayed a shear strength of ~86.1 MPa, 161% higher than that of the joints brazed by Ag–CuO braze (~33 MPa). After aging in reducing and oxidizing atmospheres (800 °C/300 h), joints remained tight and dense, indicating a better aging performance. This technique eliminates the CuO-induced issues, which may extend lifetimes for SOFC/SOEC stacks and other ceramic/metal joining applications.

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Patterned nickel interlayers for enhanced silver wetting, spreading and adhesion on ceramic substrates

Cited by 9 publications

References 45 publications

Temperature-Dependent Sheet and Contact Resistivity Measurements on Ag and Ag-Ni Circuit Pastes

Temperature-Dependent Sheet and Contact Resistivity Measurements on Ag and Ag-Ni Circuit Pastes

Joining YSZ electrolyte to AISI 441 interconnect for solid oxide cells using the Ag interlayer: Enhanced mechanical and aging properties

Joining 3YSZ Electrolyte to AISI 441 Interconnect Using the Ag Particle Interlayer: Enhanced Mechanical and Aging Properties

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