Patterning thin metallic film via laser structured weakly bound template

Laser Patterning Utilizing Masked Buffer Layer

“…In addition, separate Au, Ag and Ti deposition sources are used, with in-situ quartz microbalance detector for flux calibration measurements. A native oxide SiO 2 /Si(100) sample is attached via copper rods to a closed cycle helium cryostat (APD) that cools the sample down to 25 K with heating capability up to 800 K (Stein & Asscher, 2006). 700eV Ne + ion sputtering for sample cleaning was carried out prior to each patterning experiment.…”

“…These techniques were utilized for polymers patterning, micromachining, semiconductor processing, oxide structure formation and for nano-materials control over magnetic properties (Kelly et al, 1998, Ihlemqnn & Rubahn, 2000, Shishido et al, 2001, Chakraborty et al, 2007, Lasagni et al, 2007, Plech et al, 2009. A modified version of the BLALP technique that involves laser patterning of the clean volatile buffer layer prior to the deposition of the metal layer has also been introduced to generate smooth metallic stripes on metallic (Kerner et al, 2004c(Kerner et al, , 2006 as well as oxide (SiO 2 /Si(100)) substrates. The unique advantage of BLALP is the low laser power needed for patterning, which prevents any damage to the substrate.…”

“…Metallic lines were patterned directly on the SiO 2 /Si sample using Lift-off (Kerner et al, 2004c(Kerner et al, , 2006 and BLALP schemes. Using CO 2 as the buffer material it was possible to perform a BLALP patterning process under less stringent cooling requirements than those previously used with Xe as the buffer material (Rasmussen et al 1992, Funk et al, 2006.…”

Selective Ablation of Xe from Silicon Surfaces: Molecular Dynamics Simulations and Experimental Laser Patterning

“…12,13 With a single, low power laser pulse, the BLALP technique has been demonstrated to be capable of producing patterns of parallel stripes of potassium 6 and gold nanoclusters, 7 as well as continuous gold wires 8 strongly bound to ruthenium substrates. A modified version of the BLALP technique that involves laser patterning of the buffer layer prior to the deposition of the metal layer has also been recently used to generate smooth metallic stripes on metallic 9 as well as oxide (SiO 2 /Si(100)) substrates. The unique advantage of BLALP is the low laser power needed for patterning, which eliminates damage to the substrate commonly observed in direct laser patterning of metallic layers.…”

Weakly bound buffer layers: A versatile template for metallic nano-clusters growth and film patterning on solid surfaces

“…In situ second harmonic generation (SHG) detection from the top potassium film revealed that a single laser pulse, 10 ns long, can remove the entire Xe layer with the K atoms on top, above a certain laser power. This observation was further developed into laser-patterning of a gold film when a single laser pulse was split into two identical beams that recombine on the surface to interfere, heat the surface at the constructive interfering stripes and lead to selective buffer layer ablation from these stripes [13,[17][18][19]. In Fig.…”