Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions

Moser, Z.; Gąsior, W.; Bukat, K.; Pstruś, J.; Kisiel, Ryszard; Sitek, J.; Ishida, K.; Ohnuma, Ikuo

doi:10.1007/s11669-006-0036-9

Cited by 13 publications

(32 citation statements)

References 11 publications

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“…Generally speaking, data for the interfacial tension are lower than those for the surface tension because the fluxes decrease the surface energy. The experimental results indicate that Bi additions to Sn-Ag-Cu alloys [17] decrease the surface tensions of the alloys in both air and in the protective Ar-H 2 atmosphere. The magnitude of the decrease increases with the amount of Bi added to the alloy.…”

Section: Resultsmentioning

confidence: 90%

“…7 has been tested for the case of Bi additions to both ternary alloys, Sn76Ag0.46Cu and Sn3.13Ag0.74, and is shown in Fig. 8a, b [17]. In Fig.…”

Section: Resultsmentioning

confidence: 99%

“…In [17], based on an analysis of the data for wetting time, wetting force, contact angles, interfacial tension (solder/flux), surface tension in air, and surface tension in Ar-H 2 atmosphere for alloys starting from the binary Sn-Ag eutectic, through Sn76Ag0.46Cu and Sn3.13Ag0.74, with various amounts of Bi added, it was recognized that the interfacial tension and contact angle are the two parameters that are most important as metrics for indicating wettability. Changes in these two parameters correlate with decreasing wetting time and increasing wetting force.…”

Section: Resultsmentioning

confidence: 99%

“…3a, c). [16] illustrates the distance from investigated Pb-free alloys, (b) isotherms of the surface tension calculated at 523 K and 1,233 K of liquid Sn-Ag-Cu alloys; points taken from [16]; dotted lines are the calculated results from Butler's model, and (c) temperature dependence of density of liquid Sn-Ag-Cu alloys from [16] Now, from [17] that are present in Fig. 4a, b surface-tension measurements of two alloys, Sn2.76Ag0.46 Cu and Sn3.13Ag0.74Cu, with various amounts of Bi added.…”

Section: Surface Tension and Density Data In Protective Atmosphere (Amentioning

confidence: 99%

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Wettability Studies of Pb-Free Soldering Materials

et al. 2008

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For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler's method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag 3 Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

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Section: Resultsmentioning

confidence: 90%

“…7 has been tested for the case of Bi additions to both ternary alloys, Sn76Ag0.46Cu and Sn3.13Ag0.74, and is shown in Fig. 8a, b [17]. In Fig.…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Surface Tension and Density Data In Protective Atmosphere (Amentioning

confidence: 99%

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Wettability Studies of Pb-Free Soldering Materials

et al. 2008

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“…46 Other recognized effects of Bi as an alloying element in solders are related to its ability to effectively mitigate tin whisker growth 47 and to contribute to improvement in the wetting ability of copper surfaces. [48][49][50] …”

Section: Effects Of Bi On Mechanical Properties Of Sn-ag-cu Soldersmentioning

confidence: 99%

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

Mattila

Hokka

Paulasto‐Kröckel

2014

Journal of Elec Materi

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In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 ± 125°C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.

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Molar Volume and Surface Tension of Liquid Bi–Cu Alloys

Pstruś

Fima

2022

Metall Mater Trans A

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Bi–Cu alloys may potentially be used for thermal energy storage or as a catalyst for methane pyrolysis. For application research and simulations, it is necessary to know the reliable thermophysical properties of liquid alloys. Density of liquid Bi–Cu alloys (25, 50, 75 at. pct Cu) was measured with dilatometric method over the 971 K to 1500 K range. Density decreases linearly with temperature for all compositions. The molar volume calculated from measured densities shows positive excess molar volume. Surface tension was measured with maximum bubble pressure method over the 1125 K to 1500 K range. The data fitted with linear equations show that while the surface tension of 25 at. pct Cu decreases and that of 50 at. pct Cu alloy does not vary with temperature, the surface tension of 75 at. pct Cu alloy increases with temperature. The present results are confronted with literature data and several model calculations, part of which were performed in Pandat, and the reasons for positive excess molar volume and surface tension temperature coefficient are explained in terms of thermodynamics of Bi–Cu solutions.

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Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions

Cited by 13 publications

References 11 publications

Wettability Studies of Pb-Free Soldering Materials

Wettability Studies of Pb-Free Soldering Materials

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

Molar Volume and Surface Tension of Liquid Bi–Cu Alloys

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