PBO fibers/fluorine-containing liquid crystal compound modified cyanate ester wave-transparent laminated composites with excellent mechanical and flame retardance properties

Liu, Zheng; Fan, Xiaoli; Zhang, Junliang; Chen, Lixin; Kong, Jie; Gu, Junwei

doi:10.1016/j.jmst.2023.01.007

Cited by 32 publications

(7 citation statements)

References 58 publications

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“…synthesized fluorine‐containing liquid crystal compounds (LCFEs) to prepare the corresponding modified BPA‐type cyanate (LCFE‐BADCy) resin. When the mass fraction of LCFE was 10 wt%, the ε of LCFE‐BADCy resin was 2.61, lower than that of pure BADCy resin (3.06), and the corresponding λ was 0.33 W/(m·K), which was also higher than that of pure BADCy resin (0.25 W/(m·K)) 34 …”

Section: Introductionmentioning

confidence: 91%

“…When the mass fraction of LCFE was 10 wt%, the ε of LCFE-BADCy resin was 2.61, lower than that of pure BADCy resin (3.06), and the corresponding λ was 0.33 W/(m⋅K), which was also higher than that of pure BADCy resin (0.25 W/(m⋅K)). 34 In this work, fluorine-containing liquid crystal epoxy compounds with fluorinated groups, biphenyl units and flexible alkyl chains, are synthesized via amidation and esterification reactions. Then, 4,4′diaminodiphenylmethane (DDM) is used as a curing agent to prepare the corresponding fluorine-containing liquid crystal epoxy resins.…”

Section: Introductionmentioning

confidence: 99%

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Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures

Fan,

Liu,

Wang

et al. 2023

SusMat

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Epoxy resins with a high dielectric constant and low intrinsic thermal conductivity coefficient cannot meet the current application requirements of advanced electronic and electrical equipment. Therefore, novel fluorine‐containing liquid crystal epoxy compounds (TFSAEy) with fluorinated groups, biphenyl units, and flexible alkyl chains are first synthesized via amidation and esterification reactions. Then, 4,4′‐diaminodiphenylmethane (DDM) is used as a curing agent to prepare the corresponding fluorine‐containing liquid crystal epoxy resins. The obtained dielectric constant (ε) and dielectric loss (tan δ) values of TFSAEy/DDM at 1 MHz are 2.54 and 0.025, respectively, which are significantly lower than those of conventional epoxy resins (E‐51/DDM, 3.52 and 0.038). Additionally, the intrinsic thermal conductivity coefficient (λ) of TFSAEy/DDM is 0.36 W/(m·K), 71.4% higher than that of E‐51/DDM (0.21 W/(m·K)). Meanwhile, the corresponding elastic modulus, hardness, glass transition temperature, and heat resistance index of TFSAEy/DDM are 5.73 GPa, 0.35 GPa, 213.5°C, and 188.7°C, respectively, all superior to those of E‐51/DDM (3.68 GPa, 0.27 GPa, 107.2°C, and 174.8°C), presenting potential application in high‐heating electronic component packaging and printed circuit boards.

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Section: Introductionmentioning

confidence: 91%

Section: Introductionmentioning

confidence: 99%

Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures

Fan,

Liu,

Wang

et al. 2023

SusMat

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“…21 Therefore, improving the interfacial bond strength between PEEK matrix and CF is conducive to preventing the formation and diffusion of internal cracks in CF/PEEK composites, resulting in significantly improving their mechanical properties. 22,23 Moreover, the heat resistance, water absorption and environmental aging resistance of CF/PEEK composites are closely related to their interfacial interactions. 24 The composition, structure and morphology of interfaces of CF/PEEK composites are different from those of PEEK matrix and CF.…”

Section: Interfacial Interaction Theory Of Cf/peek Compositesmentioning

confidence: 99%

“…However, the interface is easy to produce microscopic damage and cracks under the external stress, resulting in the failure of CF/PEEK composites 21 . Therefore, improving the interfacial bond strength between PEEK matrix and CF is conducive to preventing the formation and diffusion of internal cracks in CF/PEEK composites, resulting in significantly improving their mechanical properties 22,23 . Moreover, the heat resistance, water absorption and environmental aging resistance of CF/PEEK composites are closely related to their interfacial interactions 24 …”

Section: Interfacial Interaction Theory Of Cf/peek Compositesmentioning

confidence: 99%

Interfacial strengthening and processing of carbon fibers reinforced poly(ether‐ether‐ketone) composites: A mini‐review

Dang,

Sun,

Liu

2024

Polymer Composites

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Carbon fibers/poly(ether‐ether‐ketone) (CF/PEEK) composites have the advantages of excellent impact resistance, good moisture and heat resistance, ultra‐short molding cycle and recyclable secondary processing. Therefore, the investigation on CF/PEEK composites is an important development direction of low‐cost and high‐performance polymer‐based composites. However, due to the strong surface inertness of CF and the poor interface compatibility between CF and PEEK matrix, the mechanical properties of CF/PEEK composites are low. Moreover, PEEK matrix has the high melting point and large viscosity, making the processing of CF/PEEK composites very difficult. In this paper, the factors affecting the interfacial properties of CF/PEEK composites, the surface functionalization modification methods of CF, and the design & synthesis of interfacial compatibilizer are reviewed. The research progress and related academic achievements in interfacial strengthening and additive manufacturing technology of CF/PEEK composites are emphatically discussed. Finally, the development trends and application prospects of CF/PEEK composites are summarized.Highlights CF/PEEK composite is the key material for industry and infrastructure. The factors affecting the interface interaction between PEEK and CF. The methods of interface strengthening for CF/PEEK composites. The additive manufacturing technology of CF/PEEK composites. The development trends and application of CF/PEEK composites.

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“…Besides, the microstructures of curing network of epoxy resins, such as the arrangement of molecular units, the stacking mode of molecular chains, and the cross-linking density of curing network, also can affect the molecular polarization rate and polarized molecule density of epoxy resins, endowing the low the ε and tanδ. 48 Likewise, it is possible to achieve an ordered arrangement of curing network under the external fields (force, electric and magnetic fields, etc.) by using special molding methods, such as the electrospinning technology, further reducing its ε and tanδ.…”

Section: Fabrication Of the Curing Network For Ultralow Dielectric Co...mentioning

confidence: 99%

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

Wu,

Fan,

Wang

et al. 2023

Polymers for Advanced Techs

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Epoxy resins are widely utilized in electronics, electrical components, and communication equipment for polymer‐based wave‐transparent composites. However, the dielectric constant (ε) and dielectric loss (tanδ) of common epoxy resins are relatively high (ε for 3.8–4.2; tanδ for 0.018–0.025), and the corresponding impact resistance is poor. Thus, it cannot meet the requirements of advanced microelectronic materials. And the epoxy resins prepared by filling the inorganic fillers are difficult to combine the low ε with good machining performance. The ε and tanδ of intrinsic epoxy resins can be decreased by the synthesis of epoxy monomers and curing agents and the optimization of the final curing network. Meanwhile, the use of some special processing methods, such as the electrospinning technology, is also conducive to reducing the ε and tanδ values of final epoxy‐cured resins. The factors affecting the dielectric properties of epoxy‐cured resins, and the common methods to decrease the ε value of epoxy‐cured resins are reviewed in this article. Then, the design, synthesis and research progress of ultra‐low ε epoxy resins are investigated with the relevant academic results. Finally, the development trends and application prospects of the ultra‐low ε epoxy resins are discussed.

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PBO fibers/fluorine-containing liquid crystal compound modified cyanate ester wave-transparent laminated composites with excellent mechanical and flame retardance properties

Cited by 32 publications

References 58 publications

Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures

Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures

Interfacial strengthening and processing of carbon fibers reinforced poly(ether‐ether‐ketone) composites: A mini‐review

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

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