Pd-doped Sn–Ag–Cu–In solder material for high drop/shock reliability

Yu, A-Mi; Kim, Junki; Lee, Jong‐Hyun; Kim, Mok‐Soon

doi:10.1016/j.materresbull.2009.12.030

Cited by 13 publications

(2 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…[1][2][3][4] 아울러 극미 량의 추가 합금원소의 첨가에 따라 Sn-1.0Ag-0.5Cu 조성 에 비해서도 훨씬 우수한 충격신뢰성 특성을 나타내는 것 으로 평가되어 향후 자동차 전장용 등의 상용 솔더 조성 으로의 적용이 기대된다. [5][6][7][8] 솔더 조인트(joint)의 전단 시험은 오랜 시간동안 솔더 링 특성(solderability)을 평가하는 가장 간단하고 기본적 인 시험법으로 사용되어 왔다.…”

Section: 서 론unclassified

High-Speed Shear Test Characterization of Sn-Ag-Cu-In Quaternary Solder Joint

Kim¹,

Hyun²

2014

Journal of the Microelectronics and Packaging Society

View full text Add to dashboard Cite

With Pb-free solder joints containing SnAg -Cu-based ternary alloys (Sn-1.0 wt.%Ag-0.5Cu and Sn-4.0Ag-0.5Cu) and SnAg -Cu-In-based quaternary alloys (Sn-1.0Ag-0.5Cu-1.0In, Sn-1.2Ag-0.5Cu-0.4In, Sn-1.2Ag-0.5Cu-0.6In, and Sn-1.2Ag-0.7Cu-0.4In), fracture-mode change, shear strengths, and fracture energies were observed and measured under a high-speed shear test of 500 mm/s. The samples in each composition were prepared with as-reflowed ones or solid-aged ones at 125 o C to 500 h. As a result, it was observed that ductile or quasi-ductile fracture modes occurs in the most of SnAg -Cu-In samples. The happening frequency of a quasi-ductile fracture mode showed that the SnAg -Cu-In joints possessed ductile fracture properties more than that of Sn-3.0Ag-0.5Cu in the high-speed shear condition. Moreover, the SnAg -Cu-In joints presented averagely fracture energies similar to those of SnAg -Cu joints. While maximum values in the fracture energies were measured after the solid aging for 100 h, clear decreases in the fracture energies were observed after the solid aging for 500 h. This result indicated that reliability degradation of the SnAg -Cu-In solder joints might accelerate from about that time.

show abstract