Peltier Supercooling in Transient Thermoelectrics: Spatial Temperature Profile and Characteristic Cooling Length

Ruiz-Ortega, Pablo Eduardo; Olivares-Robles, Miguel Ángel

doi:10.3390/e21030226

Cited by 13 publications

(5 citation statements)

References 19 publications

(24 reference statements)

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“…Thermoelectric semiconductor materials generally used in thermoelectric coolers are alloys of Bismuth Telluride. More thermoelectric materials are accessible according to necessary applications such as Lead Telluride (PbTe), Silicon Germanium (SiGe), and Bismuth-Antimony (Bi-Sb) alloys [16,17]. The most commonly used semiconductor material is Bismuth Telluride (Bi 2 Te 3 ) which has a dissimilar electron density.…”

Section: Thermoelectric Modulementioning

confidence: 99%

A Systematic Review of Thermoelectric Peltier Devices: Applications and Limitations

Shilpa¹,

Raheman²,

Aabid³

et al. 2023

Fluid Dynamics &Amp; Materials Processing

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Conventional refrigeration processes release ammonia and freon into the atmosphere, which results in global warming. These problems may be overcome by using thermoelectric modules because of the absence of coolants or refrigerants in these systems. However, the cooling performances of such modules are relatively small in comparison to those of conventional refrigerators. In this paper, the working principles of thermoelectric modules are discussed together with a review of different relevant aspects, namely: the thermoelectric materials, and their mechanical properties used to build thermoelectric devices, different types of thermoelectric devices available on the market, mathematical modeling of thermoelectric materials, and various applications of thermoelectric materials in different fields.

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Section: Thermoelectric Modulementioning

confidence: 99%

A Systematic Review of Thermoelectric Peltier Devices: Applications and Limitations

Shilpa¹,

Raheman²,

Aabid³

et al. 2023

Fluid Dynamics &Amp; Materials Processing

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“…In the global domain, that is, all the p‐type element, there exists local subdomains for each node, and according to the mathematical method, each subdomain must be equal to zero:

\int_{Ω} r ψ_{i} d normalΩ = 0,

where ψ i , is called the expansion function, which corresponds to the i th node analyzed and that depends only on the spatial subdomian coordinates and Ω stands for the subdomain analyzed. The detailed solution to the energy equation is developed in our previous transient state model, 31 where the equations for the total nodes are analyzed, which are functions of the 1D spatial coordinates and hence, the unknown temperatures that depend on time, is as follows

\int_{Ω} \frac{\partial^{2} T^{h}}{\partial x^{2}} ψ_{i} d normalΩ - \int_{Ω} \frac{Iτ}{Aκ} \frac{\partial T^{h}}{\partial x} ψ_{i} d normalΩ - \frac{ρ C_{p}}{κ} \int_{Ω} \frac{\partial T^{h}}{\partial t} ψ_{i} d normalΩ + \int_{Ω} \frac{I^{2} ε}{A^{2} κ} ψ_{i} d normalΩ = 0 .

…”

Section: Model Development For Pulse Operationmentioning

confidence: 99%

Transient thermal behavior of a segmented thermoelectric cooler with variable cross‐sectional areas

2021

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Summary In this work, a simulation model based on finite element analysis for a one‐dimensional p‐type segmented semiconductor element with different cross‐sectional areas is analyzed to predict transient thermal behavior for thermoelectric coolers (TECs). The proposed model considers all thermoelectric effects, including the Peltier effect, Thomson effect, Joule heating, and Fourier's heat conduction. The supercooling occurs when a pulse current higher than the steady‐state optimum current is applied to a TEC. Dynamic characteristics, such as minimum cold side temperature and holding time of transient state, which arise in transient supercooling are very important to be considered for the design and operation of TECs. In this study, we present a new approach of transient performance based on leg geometry shape, considering variable cross‐sectional areas, as well as individual element lengths of two different thermoelectric materials using a segmentation model proposed. A variety of model designs are analyzed, considering rectangular, trapezoidal, and inverse trapezoidal legs, where also optimum pulse current is found as a function of the element lengths. It is demonstrated that an improvement of 4.75% in the cooling is possible when using trapezoidal legs compared with conventional rectangular systems. Our presented model is mainly a new alternative in characterizing Peltier supercooling as a function of both pulse current ratio as well as the leg shape.

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“…Ruiz-Ortega and Olivares-Robles analyzed the transient-state equations (Equation 1) of a 1D p-type pellet using the Finite Elements Method [16],…”

Section: Peltier Cellsmentioning

confidence: 99%

“…In the case of TCC, the product H TCC • κ Peltier was observed to be approximately constant, at least under small-signal regime. Including the conversion efficiencies in Equations (13) and (14) it yields Equations (15) and (16), respectively.…”

Section: Comparison With Occmentioning

confidence: 99%

Characterization and Performance of a Thermal Camera Communication System

Guerra

Ticay-Rivas

Alonso-Eugenio

et al. 2020

Sensors

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This work presents a novel communications technology named Thermal Camera Communication (TCC), which is analogous to Optical Camera Communication (OCC). Thermographic cameras and Peltier cells are proposed as receiver and transmitter, respectively, changing completely their usual field of application. Furthermore, a comprehensive characterization of the Peltier–Thermal camera pair is carried out, presenting their bandwidth, achievable data rate under On-Off-Keying (OOK) modulation, noise characteristics, and energy efficiency. A comparison against the current state-of-the-art OCC technology is also provided, showing that TCC is a promising technology suitable for sensor networks. The thorough analysis of TCC performed in this work shows that commercial Peltier cells can be re-thought under a communications viewpoint in order to improve their performance. This novel communication technology can be applied in environments such as the access to public transportation or buildings due to the new health emergency situation. The use of thermographic cameras will become massive and dual measurement and communication purposes could be considered for applications such as sensor networks, using a yet unexploited wavelength range.

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Peltier Supercooling in Transient Thermoelectrics: Spatial Temperature Profile and Characteristic Cooling Length

Cited by 13 publications

References 19 publications

A Systematic Review of Thermoelectric Peltier Devices: Applications and Limitations

A Systematic Review of Thermoelectric Peltier Devices: Applications and Limitations

Transient thermal behavior of a segmented thermoelectric cooler with variable cross‐sectional areas

Characterization and Performance of a Thermal Camera Communication System

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