Performance Analysis of Lossy Coupled Non-uniform On-Chip Interconnects with Skin Effects

Sulochana, V.; Agrawal, Sunil; Singh, Balwinder

doi:10.1007/s00034-018-0923-4

Circuits Syst Signal Process

2018

DOI: 10.1007/s00034-018-0923-4

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Performance Analysis of Lossy Coupled Non-uniform On-Chip Interconnects with Skin Effects

V. Sulochana

Sunil Agrawal

Balwinder Singh

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2024

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Cited by 1 publication

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Improving High-Speed Interconnect Modeling: The Theta-Method for Accurate Simulation of Skin Effect and Computational Efficiency

Ait Errais,

Ait Belaid,

Belahrach

et al. 2024

ITM Web Conf.

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This paper presents a novel θ-method for modeling coupled interconnects in high-speed electronic circuits, addressing the limitations of conventional Finite-Difference Time-Domain (FDTD) techniques. The proposed method enhances simulation efficiency and accuracy, particularly in scenarios involving high frequencies and the skin effect. Through comparative analyses with established FDTD methods, we demonstrate that the θ-method not only achieves significantly shorter computation times but also provides greater accuracy and stability. The results indicate that the θ-method is a robust and reliable alternative, offering improved performance in both simulation speed and precision for complex interconnect modeling tasks.

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Improving High-Speed Interconnect Modeling: The Theta-Method for Accurate Simulation of Skin Effect and Computational Efficiency

Ait Errais,

Ait Belaid,

Belahrach

et al. 2024

ITM Web Conf.

View full text Add to dashboard Cite

show abstract

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Performance Analysis of Lossy Coupled Non-uniform On-Chip Interconnects with Skin Effects

Cited by 1 publication

References 19 publications

Improving High-Speed Interconnect Modeling: The Theta-Method for Accurate Simulation of Skin Effect and Computational Efficiency

Improving High-Speed Interconnect Modeling: The Theta-Method for Accurate Simulation of Skin Effect and Computational Efficiency

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