Performance and Optimization of Composed Fin Arrays

Braunshtein, Ofer; Kalman, Haim; Ullmann, Amos

doi:10.1080/01457630490443596

Cited by 3 publications

(1 citation statement)

References 9 publications

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“…Previous research has included this problem related to cooling electronics. These studies, including the use of air cooling systems [2][3][4][5][6][7], were designed on liquid cooling [8][9][10]. Other studies have used the heat sink (fins), including studies that used the bundle of ball networks [11,12], including piezoelectric [13] and thermal acoustic motors [14].…”

Section: Introductionmentioning

confidence: 99%

Mathematical Modeling and Optimization of Polymer Composite Pine Fins

2019

ERJ. Engineering Research Journal

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Thermal basins are used in the industry, which consists of arrays of fins, which are designed in various forms for thermal packaging of electronic devices. The best design for the consumption of thermal basins for less mass and less energy should include certain considerations, such as the choice of engineering materials and the provision of high fiber thermal conductivity fibers that are made of carbon fiber and graphite to increase thermal conductivity. This use is better than using conventional materials such as aluminum and copper. In order to achieve optimum objectives for engineering applications, an optimum design for the use of these thermal banks should be based on a precise balance between the best thermal design and the economic reduction of material consumption and minimal energy flow. The current research presents a systematic study of the thermal performance of an air cooled heat sink designed by high thermal conductivity PPS polymer. A nested pin fin set has been used to design and improve such a natural heat sink that is cooled by air.

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