Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Abstract

Advanced AI systems require more exotic packaging solutions to increase performance and manage power loads. Packaging designers not only need increased interconnect density through pitch scaling, but also seek to print this advantage over areas beyond the capability of standard lithography. These demands call for innovations in materials, processes, integrations, and tools for packaging.In a bid to find solutions for finer L/S pattern in redistribution layers, photo-imageable polyimides (PIDs) from different vendors were tested for performance properties (resolution, dose to size, sidewall quality) using direct write exposure methods, and then assessed for compatibility in a dual damascene (DD) integration for FOWLP packaging.