Performance enhancement of carbon/copper composites based on boron doping

Zuo, Haozi; Wei, Wenfu; Yang, Zefeng; Li, Xiaobo; Ren, Junwen; Xian, Yong Jun; Liao, Qianhua; Yin, Guofeng; Gao, Guoqiang; Wu, Guangning

doi:10.1016/j.jallcom.2021.160213

Cited by 16 publications

(13 citation statements)

References 32 publications

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“…Previous work [47] was further expanded by doping 0.6-3.0wt.% boron into copper [48]. Cu-B (0, 0.6, 1.2, 2.5, and 3.0wt.%) alloys were placed in a graphite mould and heated to 1423 K in a high-temperature infiltration furnace under a vacuum level of 10 −2 Pa for 1 h. Following that, a pressure of 8 MPa was applied in a nitrogen environment for 30 min, and the pressure was maintained throughout the whole process.…”

Section: Addition Of Elements Into Coppermentioning

confidence: 99%

“…The carbon preform is an important factor in determining the mechanical and physical properties of composites. The carbon preforms used in reviewed studies can be broadly divided into two categories, carbon/carbon preforms [37,38,51] and carbon preforms [48][49][50]53]. Although most of them are produced from carbon fibers [34,35,37,44,50,51], it has been observed in some cases that the starting material was carbon powder [47,52,53].…”

Section: Observed Mechanical and Physical Properties Of Cu/carbon Com...mentioning

confidence: 99%

“…The preforms produced from powder consist of more than one raw material and the main components are mostly pitch coke powder, needle coke powder, carbon black, flake graphite, etc. [48,53]. Carbide-forming metal powders are added and mixed at this stage to create an interface in the preforms produced from powder, and it is aimed to ensure homogeneous distribution [52][53][54].…”

Section: Observed Mechanical and Physical Properties Of Cu/carbon Com...mentioning

confidence: 99%

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Review of Recent Development in Copper/Carbon Composites Prepared by Infiltration Technique

Cantürk

Kováčik

2022

Energies

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The liquid metal infiltration of carbon preformed with copper and its alloys is already an established and well-known process. It is extensively used by the electronic industry to produce heat sinks of power electronics and electric contacts and sliding electric contacts. The advantage of the process is its ability to produce near net shape components with high volume fractions of carbon at a relatively low price. The process is carried out in a vacuum and with low applied pressure. However, a strong dependence on the temperature of infiltration and its precise control is significant for the sound final product. For certain pair carbon matrix–copper alloys, different results could be obtained according to the infiltration temperature. If the temperature is too low, the solidification may occur prior to complete infiltration (high final porosity). When the temperature is too high, undesirable reactions may occur at the fiber–matrix interface (e.g., corrosive carbides). Therefore, there are still a lot of scientific papers pushing this technology to new directions and over old limits. Publications inside scientific journals within this field deal with composite materials for sliding electrical contact and electrical contact materials, sealing materials, parts of brake disks, pantograph strips for high-speed railways, other electric and mechanical applications and even for wall surface shields in future fusion devices. The present paper reviews used carbon preforms, copper alloys, technological parameters, properties of prepared composites prepared via infiltration during the last 12 years. It can be stated that 1/3 of the papers were published within the last 3 years. Moreover, renewed interest in this low-cost technique could be expected within the next few years due to climate programs and increasing prices of the energy resources.

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Section: Addition Of Elements Into Coppermentioning

confidence: 99%

Section: Observed Mechanical and Physical Properties Of Cu/carbon Com...mentioning

confidence: 99%

Section: Observed Mechanical and Physical Properties Of Cu/carbon Com...mentioning

confidence: 99%

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Review of Recent Development in Copper/Carbon Composites Prepared by Infiltration Technique

Cantürk

Kováčik

2022

Energies

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“…Among them, the Cu‐C composite material that satisfies excellent thermal conductivity and low CTE is the most suitable as a heat dissipation material because it can efficiently disperse the generated heat at a low cost 18 . However, since Cu and C have insufficient wettability, heat transfer performance is lowered due to interface resistance 19,20 . In addition, graphite particles are difficult to be uniformly dispersed when forming the composite material due to a difference in density between composite materials, and layer structured graphite particles need to have orientation and be uniformly distributed in the matrix in order to improve thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

“…18 However, since Cu and C have insufficient wettability, heat transfer performance is lowered due to interface resistance. 19,20 In addition, graphite particles are difficult to be uniformly dispersed when forming the composite material due to a difference in density between composite materials, and layer structured graphite particles need to have orientation and be uniformly distributed in the matrix in order to improve thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Heat conduction and thermal expansion of copper–graphite composite as a heat sink

Lee

Son

Kim

et al. 2022

Intl J of Energy Research

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Summary This study presents the evaluation of the heat transfer characteristics and mechanical deformation of new composite material heat sinks using experimental and computational approaches. First, we synthesized a composite material composed of copper (Cu) and graphite (C) with 60 wt% Cu, with higher thermal conductivity and a lower thermal expansion coefficient than pure Cu and aluminum. The composite material was used to fabricate a heat sink integrated with an insulated‐gate bipolar mode transistor (IGBT) module for enhanced heat dissipation from the IGBT. Compared with the pure Cu heat sink, the composite heat sink decreases the average temperature of the IGBT module by approximately 22 K. It also decreases the total deformation of the heat sink caused by thermal expansion of the material by 78% and the equivalent stress by 25.2%. This study introduces a way to use Cu‐C composite materials in many potential applications, such as heat sinks integrated with IGBT inverters.

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The effect of thermal shock temperature difference on the structural, dynamics and mechanical properties of carbon materials characterized by ultrasonic test technology

et al. 2021

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Performance enhancement of carbon/copper composites based on boron doping

Cited by 16 publications

References 32 publications

Review of Recent Development in Copper/Carbon Composites Prepared by Infiltration Technique

Review of Recent Development in Copper/Carbon Composites Prepared by Infiltration Technique

Heat conduction and thermal expansion of copper–graphite composite as a heat sink

The effect of thermal shock temperature difference on the structural, dynamics and mechanical properties of carbon materials characterized by ultrasonic test technology

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