2012
DOI: 10.5098/fhp.v3.1.3003
|View full text |Cite
|
Sign up to set email alerts
|

Performance Evaluation of Thermosyphon Integrated Heat Sink for Cpu Cooling

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2015
2015
2015
2015

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 6 publications
0
1
0
Order By: Relevance
“…Specifically, an undesirable rise in the CPU temperature may occur, as capillary forces may be insufficient to provide the required amount of working fluid to the HP evaporator, potentially leading to failure of the device [80]. Wang [81], as well as Anandan and Bhaskaran [82] investigated configurations similar to those of Fig. 10.…”
Section: Electronics/cpu Cooling Using Hphssmentioning
confidence: 99%
“…Specifically, an undesirable rise in the CPU temperature may occur, as capillary forces may be insufficient to provide the required amount of working fluid to the HP evaporator, potentially leading to failure of the device [80]. Wang [81], as well as Anandan and Bhaskaran [82] investigated configurations similar to those of Fig. 10.…”
Section: Electronics/cpu Cooling Using Hphssmentioning
confidence: 99%