2007
DOI: 10.1109/tcapt.2007.898366
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Performance Improvement of a Power Conversion Module by Liquid Micro-Jet Impingement Cooling

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Cited by 48 publications
(11 citation statements)
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“…Korronte altuak direla eta, handitu egiten dira Itxaso Aranzabal, Asier Matallana, Oier Onederra, Iñigo Martinez de Alegria, David Cabezuelo gailu erdieroale horietan gertatzen diren kommutazio-galerak (P loss,sw ) eta kondukzio-galerak (P loss,cond ), eta ondorioz, potentzia-erdieroaleak berotu egiten dira. Gaur egun, ibilgailu elektrikoari dagozkion IGBT moduluetan bero-fluxua 100-150 W/cm 2 -koa da eta espero da hurrengo urteetan 500 W/cm 2 -ra igotzea [1] (1. irudia).…”
Section: Sarreraunclassified
“…Korronte altuak direla eta, handitu egiten dira Itxaso Aranzabal, Asier Matallana, Oier Onederra, Iñigo Martinez de Alegria, David Cabezuelo gailu erdieroale horietan gertatzen diren kommutazio-galerak (P loss,sw ) eta kondukzio-galerak (P loss,cond ), eta ondorioz, potentzia-erdieroaleak berotu egiten dira. Gaur egun, ibilgailu elektrikoari dagozkion IGBT moduluetan bero-fluxua 100-150 W/cm 2 -koa da eta espero da hurrengo urteetan 500 W/cm 2 -ra igotzea [1] (1. irudia).…”
Section: Sarreraunclassified
“…The jet impingement parameters chosen in this study are based on our prior experience and multiple publications (e.g. [5,7]). They may not be optimal and the optimization is not the focus of this study.…”
Section: Lower Jfet Switchesmentioning
confidence: 99%
“…3,4], and jet impingement [e.g. 5,6] are the most commonly investigated approaches. In this article we present a resounding evidence of the necessity of these solutions and their effectiveness for cooling, specifically for silicon carbide (SiC) power electronics developed for military hybrid vehicle applications.…”
Section: Introductionmentioning
confidence: 99%
“…Investigation of recent liquid cooled power modules revealed a trend towards more intricate heatsink designs to improve the heat transfer ability in closed single [3], pin-fin geometries [4] and jet impingement techniques [5]. This trend reflects manufacturers need for ever greater semiconductor dissipation rates (in excess of 200W/cm 2 ).…”
Section: Heatsink Designs Studymentioning
confidence: 99%