Performance of Microchannel Heat Sink Made of Silicon Material with the Two-Sided Wedge

Vatsa, Aditya; Alam, Tabish; Siddiqui, Irfanul Haque; Ali, Masood Ashraf; Dobrotă, Dan

doi:10.3390/ma15144740

Cited by 7 publications

(3 citation statements)

References 26 publications

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“…The highest thermal enhancement factor of 1.6 was obtained for MC-SWTR at Re = 1000. Using CFD, Vatsa et al [5] investigated a microchannel with a two-sided wedge shape at the base. The Nusselt number and the friction factor were analyzed for different wedge angles (3°to 15°) and Reynolds numbers.…”

Section: Introductionmentioning

confidence: 99%

Thermal enhancement of microchannel heat sink using pin-fin configurations and geometric optimization

Wazir,

Akhtar,

Ghani

et al. 2024

Eng. Res. Express

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The microchannel heat sink (MCHS) is a robust cooling technique that ensures the efficiency and reliability of compact electronic devices by dissipating a large amount of heat due to its high surface area-to-volume ratio. This study proposes a novel modification of the pin-fins geometry in MCHS, and geometric optimization using response surface methodology (RSM) is achieved to build a low thermal resistant MCHS with enhanced heat transfer efficiency with low-pressure drop. Numerical simulations are performed on three pin-fins configurations, i.e., MC-BW (pins mounted transversely to the bottom wall), MC-SW (pins mounted transversely to the side wall), and MC-Mixed (pins mounted transversely to the bottom and side wall). The thermal and flow characteristics are investigated using a laminar conjugate heat transfer model at Reynolds numbers 100-1000. Results show that introducing pin-fins significantly enhances heat dissipation as it continuously breaks the boundary layer and generates flow separation downstream of the pin-fins, which enhances fluid mixing and increases heat transfer augmentation inside MCHS. Among different configurations, the MC-Mixed gives the highest improvement of 50% in the convective heat transfer coefficient at Re = 1000. The highest thermal enhancement factor of η=1.4 is obtained for the MC-Mixed configuration at Re = 600. Response surface methodology yields optimized values of transverse pitch, longitudinal pitch, and diameter of pin equal to 2.50mm, 0.25mm, and 0.045mm, respectively, for base wall pin fin configuration and transverse pitch, longitudinal pitch, the diameter of pin and pitch of side wall pins equal to 1.0mm, 0.150mm, 0.035mm, and 1.250mm respectively for mixed pin fin configuration for maximum heat transfer and minimum pressure drop. The ANSYS FLUENT 2021 R2 software is used to conduct three-dimensional RANS simulations. The QUICK and second upwind interpolation schemes are employed to solve the diffusive and convective components of the momentum, energy, and continuity equations.

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Section: Introductionmentioning

confidence: 99%

Thermal enhancement of microchannel heat sink using pin-fin configurations and geometric optimization

Wazir,

Akhtar,

Ghani

et al. 2024

Eng. Res. Express

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show abstract

“…The passage of MCHS has been explored, such as channel shape in the wavy form [ 20 ] and tapered form [ 21 ]. Additionally, the cross-section of the passage in the following shapes—circular [ 22 ], wedge [ 23 ], rectangular [ 24 ], triangular [ 25 ] and square [ 26 ]—have been exploited. Further, the effect of surface modification in a passage in the form of fins [ 27 ], ribs [ 28 ], fillets [ 29 ], dimples [ 30 ], sinusoidal wavy [ 31 ] and periodic expansion–constriction [ 32 ] have been explored and investigated.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Microchannel Heat Sink of Silicon Material with Right Triangular Groove on Sidewall of Passage

et al. 2022

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Microchannel heat sink (MCHS) is a promising solution for removing the excess heat from an electronic component such as a microprocessor, electronic chip, etc. In order to increase the heat removal rate, the design of MCHS plays a vital role, and can avoid damaging heat-sensitive components. Therefore, the passage of the MCHS has been designed with a periodic right triangular groove in the flow passage. The motivation for this form of groove shape is taken from heat transfer enhancement techniques used in solar air heaters. In this paper, a numerical study of this new design of microchannel passage is presented. The microchannel design has five variable groove angles, ranging from 15° to 75°. Computational fluid dynamics (CFD) is used to simulate this unique microchannel. Based on the Navier–Stokes and energy equations, a 3D model of the microchannel heat sink was built, discretized, and laminar numerical solutions for heat transfer, pressure drop, and thermohydraulic performance were derived. It was found that Nusselt number and thermo-hydraulic performance are superior in the microchannel with a 15° groove angle. In addition, thermohydraulic performance parameters (THPP) were evaluated and discussed. THPP values were found to be more than unity for a designed microchannel that had all angles except 75°, which confirm that the proposed design of the microchannel is a viable solution for thermal management.

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“…The results show that it is incorrect to study performance metrics using a Reynolds number, since each coolant has different thermophysical properties, and that the use of nanofluids in MCHS is not feasible because water is more practical and less hazardous. In another study, Vatsa et al [18] investigated the results of silicon MCHS using a two-sided wedge. According to their findings, a microchannel with a wedge angle of 15 • can increase both the Nusselt number and the thermohydraulic efficiency.…”

Section: Introductionmentioning

confidence: 99%

Impact on Heat Transfer Rate Due to an Extended Surface on the Passage of Microchannel Using Cylindrical Ribs with Varying Sector Angle

et al. 2022

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In this paper, the impact of an extended surface on the passage of a microchannel using cylindrical ribs with variable sector angles on heat transfer rate is presented using computer simulation. Extended surfaces in the form of cylindrical ribs of varying sector angles in the passage of microchannel in a staggered manner have been designed. The sidewalls of a new kind of microchannel incorporating five distinct ribs with sector angles ranging from 45° to 80° have been analyzed. Ansys Fluent workbench software has been exploited to simulate this novel design of a microchannel heat sink. A three-dimensional heat transfer and fluid flow model of the microchannel heat sink (MCHS) was developed, and the fluid and solid regions were discretized in very fine meshes. All CFD simulations were performed for Reynolds numbers between 100 and 900. Nusselt numbers are varied in the following ranges: 6.93 to 13.87, 6.93 to 14.38, 6.93 to 17.80, 7.15 to 27.86, and 7.20 to 37.38 at sector angles of 45°, 50°, 60°, 70°, and 80°, respectively. It is concluded that the Nusselt number is strongly influenced by the Reynolds number. At an angle of 80°, the maximum friction factor and pumping power requirements were observed. Additionally, a 45° angle has been proven to be the minimal friction factor and pumping power requirement. It is revealed that the THPP has all values larger higher than 1. At angles of 80° and 45°, the maximum and minimum values of THPP have been discovered, respectively. In addition, thermo-hydraulic performance parameters have been evaluated, which are greater than one for all sector angles.

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Performance of Microchannel Heat Sink Made of Silicon Material with the Two-Sided Wedge

Cited by 7 publications

References 26 publications

Thermal enhancement of microchannel heat sink using pin-fin configurations and geometric optimization

Thermal enhancement of microchannel heat sink using pin-fin configurations and geometric optimization

Analysis of Microchannel Heat Sink of Silicon Material with Right Triangular Groove on Sidewall of Passage

Impact on Heat Transfer Rate Due to an Extended Surface on the Passage of Microchannel Using Cylindrical Ribs with Varying Sector Angle

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