Periodic nanostructures imprinted on high-temperature stable sol–gel films by ultraviolet-based nanoimprint lithography for photovoltaic and photonic applications

Back, Franziska; Bockmeyer, Matthias; Rudigier‐Voigt, Eveline; Löbmann, Peer

doi:10.1016/j.tsf.2014.04.082

Cited by 24 publications

(20 citation statements)

References 35 publications

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“…The final shark-skin patterns were composed of 1.6 μm height and 1.3 μm width pillars in every case, suggesting that both types of binders (organic or inorganic) were efficient in the process. In 2014, Back et al, 42 reported the impact of silica-based formulation on the shrinkage and crack formation during densification on glass through UV-NIL. Two sol-gel sources of SiO2 were used: the binder composed of Tetraethoxysilane (TEOS) and 3-glycidoxypropyltriethoxysilane (GPTES) (hybrid polymeric binder) and colloids composed of SiO2 NPs.…”

Section: Uv-nil From Hybrid (Organic/inorganic) Resinsmentioning

confidence: 99%

“…Table 3. Comparison of residual stress and film porosity of pure binder system and particle-filled systems with a particle content of 40 wt% after thermal curing at 500 °C for 1 h. 42 When the annealing temperature increases from 200 to 500 °C, features lose 64% in volume, which can be considerably reduced when using high concentrations of dense silica sources. In addition, less shrinkage is accompanied by less cracks, suggesting that the presence of NPs allowed for better stress relaxation during densification.…”

Section: Uv-nil From Hybrid (Organic/inorganic) Resinsmentioning

confidence: 99%

“…In 2014, Back et al 42 reported the impact of silica-based formulation on the shrinkage and crack formation during densification on glass through UV-NIL. Two sol−gel sources of SiO 2 were used: the binder composed of tetraethoxysilane (TEOS) and 3-glycidoxypropyltriethoxysilane (GPTES) (hy- brid polymeric binder) and colloids composed of SiO 2 NPs.…”

Section: Kim Et Al In 2005mentioning

confidence: 99%

“…(a) SEM images of nanostructured films after thermal treatment (from left to right: solutions prepared with a pure binder system, a sol–gel matrix with 40 wt % spherical SiO 2 particles content, and a sol–gel matrix with 40 wt % branched SiO 2 ). AFM profiles of nanostructures were obtained with a pure binder (b) and a sol–gel matrix with 40 wt % branched SiO 2 particles (c) . Reprinted with permission from Back, F.; Bockmeyer, M.; Rudigier-Voigt, E.; Löbmann, P. Periodic Nanostructures Imprinted on High-Temperature Stable Sol–Gel Films by Ultraviolet-Based Nanoimprint Lithography for Photovoltaic and Photonic Applications.…”

Section: Uv-nil Processesmentioning

confidence: 99%

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Nanoimprint Lithography Processing of Inorganic-Based Materials

et al. 2021

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We review past and recent progress in Nano-Imprint Lithography (NIL) methods to (nano-) structure inorganic materials from sol-gel liquid formulations and colloidal suspensions onto a surface. This technique, first inspired by embossing techniques, was developed for soft polymer processing, as final or intermediate materials, but is today fully adapted to hard inorganic materials with high dielectric constant, such as metal oxides, with countless chemical compositions provided by the sol-gel chemistry. Consequently, NIL has become a versatile, high throughput, and highly precise microfabrication method that is mature for lab developments and scaling up. We first describe the state-of-the-art in nanofabrication methods and the plethora of approaches developed in the last decades to imprint metal oxides from inorganic solutions. These are discussed and compared in terms of performances, issues, and ease of implementation. The final part is devoted to relevant applications in domains of interest. Generalities on Nano fabrication techniques and NILFrom the early ages, technics to cut, sculpt, etch, mold, assemble pieces of matter have been developed and constantly optimized to satisfy the growing demand for functional materials. Since the inception of nanotechnology, these operations have to be mastered at the nanoscale. For these tasks, many top-down and bottom-up methods exist. However, they do not simultaneously fulfill all the necessary criteria of performance such as spatial resolution, pattern complexity, hierarchy, scalability, dimensionality, costeffectiveness, a span of processable materials. Thus, motivations to optimize them and develop new ones persist as a flourishing domain of research and development.Many materials exhibiting various intrinsic properties (mechanical, chemical, electrical, optical, thermal, etc.) are exploited in numberless functions once nanostructured onto a surface. Amongst them, metal oxides are extremely valuable for their extreme chemical, mechanical and thermal stability and range of physicalchemical properties. Thanks to its hardness, chemical inertness, transparency and low background fluorescence, glass is one of the preferred choices for micro-and nano-fluidics device fabrication. In photonics, metasurfaces require optical properties that are found in dielectrics such as SiO2 often combined with high index dielectric TiO2 or (plasmonic) gold 1 . For nano-electronics, silica remains one of the key

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Section: Uv-nil From Hybrid (Organic/inorganic) Resinsmentioning

confidence: 99%

Section: Uv-nil From Hybrid (Organic/inorganic) Resinsmentioning

confidence: 99%

Section: Kim Et Al In 2005mentioning

confidence: 99%

Section: Uv-nil Processesmentioning

confidence: 99%

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Nanoimprint Lithography Processing of Inorganic-Based Materials

et al. 2021

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“…Signicant recent investigation has been undertaken into the electrodeposition of nanowires of various metals and dimensions. The unique conductivity behaviour of many materials at the nanowire scale 1 has also led to investigation towards their use in thermoelectric materials, [2][3][4][5][6] solar energy, 1,7 batteries and capacitors, 8,9 and sensors. 1,3,[10][11][12] One method to form nanowires is to electrodeposit conducting materials inside the pores of porous anodic aluminium oxide (AAO) membranes.…”

Section: Introductionmentioning

confidence: 99%