2016
DOI: 10.1016/j.ceramint.2016.02.149
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Permittivity reduction and surface modification by porosification of LTCC

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Cited by 10 publications
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“…Furthermore, the integration of high-k and low-k materials with defined thickness and low loss tangent is crucial for the realization of the next generation of high-frequency circuits [15,17]. It has been recently shown that a defined porosification of sintered LTCC by wet chemical etching can be used to tune permittivity [22,23].Further, porosification depends on the sintering process [24]. Present voids decrease permittivity and loss tangent.…”
Section:  Introductionmentioning
confidence: 99%
“…Furthermore, the integration of high-k and low-k materials with defined thickness and low loss tangent is crucial for the realization of the next generation of high-frequency circuits [15,17]. It has been recently shown that a defined porosification of sintered LTCC by wet chemical etching can be used to tune permittivity [22,23].Further, porosification depends on the sintering process [24]. Present voids decrease permittivity and loss tangent.…”
Section:  Introductionmentioning
confidence: 99%