Perovskite modules with 99% geometrical fill factor using point contact interconnections design

Abstract

Thin-film photovoltaic technology, based on hybrid metal halide perovskites, has achieved 25.2% and 16.1% certified power conversion efficiencies for solar cell and solar module devices, respectively. Still, the gap between power conversion efficiency of small area solar cells and large area solar modules is greater than for any other photovoltaic technology. Analysis of loss mechanisms in n-i-p solution processed devices defined layer inhomogeneity loss and inactive area loss as the two most prominent loss mechanisms in upscaling. In this study, we focus on minimizing inactive area loss. We analyze the point contact interconnections design and demonstrate it on perovskite thin-film solar modules to achieve a geometrical fill factor of up to 99%. Numerical and analytical simulations are utilized to optimize interconnections and solar module design and balance inactive area loss, series resistance loss, and contact resistance loss.

Upscaling Solution‐Processed Perovskite Photovoltaics

“…As a result, perovskite modules fabricated through all‐laser scribing have achieved a GFF of up to 99%. [ 122 ]…”

Upscaling of perovskite solar modules: The synergy of fully evaporated layer fabrication and all‐laser‐scribed interconnections

“…In that regard, the concept of point interconnections recently introduced by Rakocevic et al for perovskite minimodules might also be of significant interest for further development. 102 Furthermore, the strong analogy of the developed approach to the manufacturing of established thin-film technologies potentially benefits further upscaling via knowledge transfer. For instance, the common utilization of additional scanner lens systems to increase module width and throughput is expected to enable the fabrication of modules of several hundred square centimeters with GFFs of 96% or above.…”

“…As a consequence of the solar module interconnection, two loss mechanisms arise, namely, (1) contact resistance at the interconnections and (2) a reduction of the active area required for the interconnection. 101,102 Therefore, in order to maximize performance in thin-film PV modules, it is crucial to minimize these individual losses by employing suitable scribing methods and interconnection layouts. Realization of the three essential interconnection lines (commonly referred to as P1, P2, and P3) is performed via either mechanical scribing, 103 chemical etching, lift-off processes, 27,104 laser scribing, 59 or a combination of these methods.…”

“…59 Furthermore, by developing a laser-scribed point contact interconnection scheme, Rakocevic et al have shown that the active area loss can be reduced to as little as 1% rel for a 4-cm 2 aperture area device. 102 It should be noted that most previous studies on all-laser-scribed interconnections of perovskite minimodules used more than one lasing source to process all three interconnection lines (e.g., with different wavelengths) and in many cases picosecond and femtosecond laser sources were applied. 59,69,[112][113][114] While shorter pulses commonly allow for more selective laser ablation, the complexity and also price of such lasing sources increases below 100 picoseconds.…”

Contactless Series Resistance Imaging of Perovskite Solar Cells via Inhomogeneous Illumination

“…Nevertheless, the commercialization of PSC still faces key challenges that need to be addressed to make this technology competitive: 1) long‐term stability [ 3,4 ] and 2) device area upscaling. [ 5–7 ] Critical aspects of PSCs upscaling are obtaining homogeneous perovskite absorber layer properties and selective contacts, [ 8,9 ] as well as minimal resistive losses. [ 5,10,11 ] Development of suitable characterization techniques, which can reliably and rapidly identify the factors contributing to these two main issues, is essential.…”