“…Moreover, the use of well-known sacrificial layers like porous silicon, polysilicon, silicon dioxide and phosphosilicate glass (PSG) requires hazardous chemicals like HF, which also attacks ZnO simultaneously [11][12][13][14]. Furthermore, ZnO films are used as a sacrificial layer for the fabrication of microstructures, because it has faster etching rate in both acidic and alkaline chemicals [15,16]. So, a diluted chemical may attack and deform the shape and size of nanowires in active region during fabrication process.…”