Phase change-induced tunable dielectric permittivity of poly(vinylidene fluoride)/polyethylene glycol/graphene oxide composites

Tu, Junyang; Li, Hairong; Cai, Ziqing; Zhang, Jingjing; Xiang, Haiyan; Huang, Jing; Xiong, Chuanxi; Jiang, Ming; Huang, Leping

doi:10.1016/j.compositesb.2019.106920

Cited by 22 publications

(13 citation statements)

References 29 publications

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“…Recently, a thermal‐induced dielectric susceptibility has been observed in polyethylene glycol (PEG)‐contained composites. [ 15,16 ] The use of PEG as a thermally responsive dielectric material is very promising. The switching between high and low dielectric states can be triggered by the crystalline‐amorphous phase transition of PEG induced by heat.…”

Section: Introductionmentioning

confidence: 99%

Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films

Gong

et al. 2022

Polymer Engineering & Sci

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Dielectric materials with thermally responsive property are being pursued in fields such as next-generation sensors, smart switches, and novel actuators. These applications require that the dielectric materials have mechanical durability and stable serviceability besides thermally responsive dielectric behavior. Herein, we report a novel thermally responsive, mechanically durable, and low-cost dielectric composite simply fabricated by vacuum impregnating polyethylene glycol (PEG) into kapok fiber and compounding them with polyvinylidene fluoride. A remarkable dielectric susceptibility, controlled dielectric transition temperature, and obvious thermal hysteresis of the composite films induced by the solid-liquid phase transition of PEG are demonstrated. The effect of molecular weights of PEG on the dielectric response behaviors is evaluated. Such thermally responsive dielectric materials with satisfactory mechanical durability will offer a chance toward constructing thermally responsive systems for reliable and stable operation.

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Section: Introductionmentioning

confidence: 99%

Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films

Gong

et al. 2022

Polymer Engineering & Sci

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show abstract

“…Recently, a thermal-induced dielectric susceptibility has been observed in PEG-contained composites. [15,16] The use of PEG as a thermally responsive dielectric material is very promising. The switching between high and low dielectric states can be triggered by the crystalline-amorphous phase transition of PEG induced by heat.…”

Section: Introductionmentioning

confidence: 99%

Thermal-induced dielectric response in mechanically durable polyvinylidene fluoride/kapok encapsulated polyethylene glycol composite films

Gong

et al. 2022

Preprint

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Dielectric materials with thermally responsive property are being pursued in fields such as next-generation sensors, smart switches, and novel actuators. These applications require that the dielectric materials have mechanical durability and stable serviceability besides thermally responsive dielectric behavior. Herein, we report a novel thermally responsive, mechanically durable, and low-cost dielectric composite simply fabricated by vacuum impregnating polyethylene glycol (PEG) into Kapok fiber (KF) and compounding them with polyvinylidene fluoride (PVDF). A remarkable dielectric susceptibility, controlled dielectric transition temperature and obvious thermal hysteresis of the composite films induced by the solid-liquid phase transition of PEG are demonstrated. The effect of molecular weights of PEG on the dielectric response behaviors is evaluated. Such thermally responsive dielectric materials with satisfactory mechanical durability will offer a chance toward constructing thermally responsive systems for safe and stable operation.

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“…Therefore, the preparation of a matrix with an adjustable pore size is of great significance to the research of the PCM. However, nowadays, many studies were keen to encapsulate phase change materials through natural porous minerals and improve the thermal conductivity of CPCMs by adding some high thermal conductivity materials such as graphene and carbon nanotubes. − In recent years, CPCMs with dual functions had also been extensively studied. − However, there are few studies on the regulation of a matrix pore structure. The porous hydroxyapatite foam (PHF) prepared by using the micron-sized emulsion as a template has a controlled “cell–window” structure, which provides conditions for us to study the influence of the pore structure on the phase transition.…”

Section: Introductionmentioning

confidence: 99%

Porous Hydroxyapatite Foams: Excellent Carrier of Hydrated Salt with Adjustable Pores for Thermal Energy Storage

Wang

et al. 2021

Ind. Eng. Chem. Res.

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Porous hydroxyapatite foam (PHF) was synthesized via a Pickering emulsion template for encapsulating disodium hydrogen phosphate dodecahydrate (DHPD). PHF consisted of open large pores connected by a window structure, and its pore size was adjusted in the range of 1.78 to 14.87 μm. The contact angle test proved that PHF owned a good adsorption to DHPD. In SEM and EDS images, the interconnected pore structure and packaging characteristics were proved. Through XRD, FT-IR, and TGA analysis, it was proved that the composite phase change material (CPCM) had well chemical stability and thermal stability. The most favorable thermal performance was shown by the sample with a pore diameter of 5.32 μm, and its phase transition temperature and phase transition enthalpy were 44.6 °C and 177.1 J/g, respectively. In addition, the latent heat only decreased by 0.83% after 100 thermal cycles, which reflected a favorable thermal reliability. Therefore, the prepared CPCM owned promising ion potentials in waste heat recovery and building energy saving.

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Phase change-induced tunable dielectric permittivity of poly(vinylidene fluoride)/polyethylene glycol/graphene oxide composites

Cited by 22 publications

References 29 publications

Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films

Thermal‐induced dielectric response in mechanically durable polyvinylidene fluoride–kapok encapsulated polyethylene glycol composite films

Thermal-induced dielectric response in mechanically durable polyvinylidene fluoride/kapok encapsulated polyethylene glycol composite films

Porous Hydroxyapatite Foams: Excellent Carrier of Hydrated Salt with Adjustable Pores for Thermal Energy Storage

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