2004
DOI: 10.1117/12.580003
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Phase defect printability and mask inspection capability of 65-nm technology node Alt-PSM for ArF lithography (Photomask Japan Best Paper)

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“…[1][2][3][4][5] Usually, for any new technology node and material type extensive printability studies are performed in collaboration between maskhouse and customer to find an appropriate AIMS TM defect dispositioning criterion telling whether a defective site will later-on print on the wafer and therefore needs to be repaired or not. [6][7][8][9][10] Currently, a lot of effort is put on the simulation of defect printing to reduce the time consumption of printing studies and also to disposition defects in production. [11][12][13][14] However, the matching between AIMS TM results and simulations is often unsatisfactory since the imperfections of the AIMS TM optics are normally not included in simulations (e.g., flare, aberrations, cross-talk, inhomogeneous illumination).…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5] Usually, for any new technology node and material type extensive printability studies are performed in collaboration between maskhouse and customer to find an appropriate AIMS TM defect dispositioning criterion telling whether a defective site will later-on print on the wafer and therefore needs to be repaired or not. [6][7][8][9][10] Currently, a lot of effort is put on the simulation of defect printing to reduce the time consumption of printing studies and also to disposition defects in production. [11][12][13][14] However, the matching between AIMS TM results and simulations is often unsatisfactory since the imperfections of the AIMS TM optics are normally not included in simulations (e.g., flare, aberrations, cross-talk, inhomogeneous illumination).…”
Section: Introductionmentioning
confidence: 99%