Phase diagrams for lead-free solder alloys

Kattner, Ursula R.

doi:10.1007/bf02709189

Cited by 88 publications

(52 citation statements)

References 27 publications

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“…The counting rates obtained for Ag, Cu and Ti by EPMA in the thickest parts of each layer were characteristic for single-phased compounds arranged according to the reaction layer sequence: Fig. 3 shows the isothermal section of the Ag-Cu-Ti phase diagram at 790 °C, calculated with the Thermo-calc software by using the already developed thermodynamic descriptions of the Ag-Cu [9], Ag-Ti [10] and Cu-Ti [11] binaries. Extension to the third-order Ag-Cu-Ti system was made by using the assessment by Arroyave [12].…”

Section: Ag-40 At% Cu Liquid Without Timentioning

confidence: 99%

Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy

Andrieux

Dezellus

Bosselet

et al. 2008

J. Phase Equilib. Diffus.

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Reaction zones formed at 790 °C between solid titanium and liquid Ag-Cu eutectic alloys (pure and Ti-saturated) have been characterized. When pure Ag-Cu eutectic alloy with 40 at.% Cu is used, the interface reaction layer sequence is: αTi / Ti 2 Cu / TiCu / Ti 3 Cu 4 / TiCu 4 / L. Because of the fast dissolution rate of Ti in the alloy, the reaction zone remains very thin (3-6 µm) whatever the reaction time. When the Ag-Cu eutectic alloy is saturated in titanium, dissolution no longer proceeds and a thicker reaction zone with a more complex layer sequence grows as the reaction time increases. Four elementary chemical interaction processes have been identified in addition to Ti dissolution in the liquid alloy. These are growth of reaction layers on Ti by solid state diffusion, nucleation and growth from the liquid of TiCu 4 , isothermal solidification of silver and, finally, chemical conversion of the Cu-Ti compounds by reaction-diffusion in the solid state. A mechanism combining these processes is proposed to account for the constitution of Ti/ Ag-Cu/ Ti joints brazed at 780-800 °C.

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Section: Ag-40 At% Cu Liquid Without Timentioning

confidence: 99%

Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy

Andrieux

Dezellus

Bosselet

et al. 2008

J. Phase Equilib. Diffus.

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“…Liu and Sun, 27 based on a DTA study of 12 cross-sections, established a ternary eutectic at 531 K for 5Ag-94.5Bi-0.5Cu (at.%) and proposed the liquidus projection. The liquidus projections were calculated from extrapolated binary data by Kattner 28 and Doi et al 12 Although they used different sets of binary data, the outcomes of their calculations were close and in reasonable agreement with the data of Liu and Sun. 27 Recently, we have studied phase transitions with temperature in 24 alloys 17 characterized by fixed molar ratios of Ag to Bi (0.25, 1, 4) and varying copper content, and compared the results with transition temperatures calculated from extrapolated binary data in the SOLDERS database.…”

Section: Phase Diagram Literature Surveymentioning

confidence: 81%

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Fima

Garzeł

Sypień

2014

Journal of Elec Materi

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The phase equilibrium in the Ag-Bi-Cu system was experimentally determined at 573 K, 773 K, and 973 K by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) on annealed alloys and liquid/solid couples. The experimental results indicate that the mutual solubility of the components is limited. Based on the present results and literature data, phase equilibria in the Ag-Bi-Cu system were thermodynamically assessed. Wetting of Bi-2.6Ag-xCu alloys on Cu substrates was studied with the sessile drop method in the presence of flux at 573 K and 623 K. It was found that the wetting to non-wetting transition corresponds to the solubility limit of Cu in liquid. Selected solidified solder-substrate couples were cross-sectioned and their interfacial microstructure examined with SEM-EDS. There are no reaction products at the interface, but the copper surface becomes rough because of dissolution by liquid solder.

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“…Figures 11 and 12 show the backscattered electron (BSE) images of IMC layers formed at both sides, namely at the substrate and porous Cu interlayer. The elements of the selected surface are listed in Table 4, together with their respective phases as identified according to the Sn-Cu phase diagram [31]. Basically, the Cu atoms of IMC phase migrated from SAC305 solder alloy and the Cu substrate to form Cu 6 Sn 5 phase joining interface [32,33].…”

Section: Interfacial Structure Analysismentioning

confidence: 99%

“…their respective phases as identified according to the Sn-Cu phase diagram [31]. Basically, the Cu atoms of IMC phase migrated from SAC305 solder alloy and the Cu substrate to form Cu6Sn5 phase joining interface [32,33].…”

Section: Interfacial Structure Analysismentioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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Phase diagrams for lead-free solder alloys

Cited by 88 publications

References 27 publications

Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy

Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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