The reactive ion etching of silicon in SF~/O2 mixtures is investigated experimentally. Electrical measurements, using a Langmuir probe, provide the plasma density of the discharge, for various settings of pressure and oxygen percentage. The plasma density ranges between 4 • 109 and 1.2 • 101~ cm -~. Information on the chemical composition of the discharge is obtained using a mass spectrometer. The lower electrode self-bias voltage ranges between 0 and 590 V and the etching rate between 100 and 17,000 A/min. The variation of the relative contribution of chemical etching and ion bombardment to the overall etching rate is demonstrated, as the process parameters are changed. Etching uniformity is also studied and the etching rate is found to be higher near the edge of the electrode. ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 142.58.129.109 Downloaded on 2015-05-30 to IP
ABSTRACTOxygen incorporation into Czochralski silicon crystals during crystal growth is influenced by reactions at the crucible interface. In the present study it was found that different dopants have different effects on these reactions, both in sealed ampuls and in Czochralski crucibles. Different reaction products and morphologies are formed along the interface depending on dopant types and levels. It was concluded that some of these reactions can affect the oxygen concentration in the melt. The dopants investigated were B, A1, Ga, In, Ge, Sn, P, As, Sb, and Bi.