Phase equilibria and solidification properties of Sn-Cu-Ni alloys

Lin, Chih‐Hao; Chen, Sinn-wen; Wang, Chao-hong

doi:10.1007/s11664-002-0182-8

Cited by 157 publications

(33 citation statements)

References 4 publications

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“…Also, Cu-Nirich phase has been found as the dark grey region in Fig. 2 (e) due to the solid solution formed by Cu and Ni, which has been discussed by Lin et al [15]. Bi-rich phase has been found as the white region.…”

Section: Microstructure and Phase Analysis Before Corrosion Testsupporting

confidence: 51%

Corrosion reliability of lead-free solder systems used in electronics

Verdingovas

Medgyes

et al. 2017

2017 40th International Spring Seminar on Electronics Technology (ISSE)

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Section: Microstructure and Phase Analysis Before Corrosion Testsupporting

confidence: 51%

Corrosion reliability of lead-free solder systems used in electronics

Verdingovas

Medgyes

et al. 2017

2017 40th International Spring Seminar on Electronics Technology (ISSE)

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“…26 Another possibility is that, when the Cu flux from the chip side meets the Ni atoms in the substrate, they form Cu-Ni-Sn ternary compounds right away. Since the Cu dissolution rate in solder is faster than that of Ni in solder, Cu atoms may diffuse to the substrate side before the Ni atoms reach the chip side.…”

Section: Tl Shao Et Al: Cross Interactions On Interfacial Compoundmentioning

confidence: 99%

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao¹,

Chen²,

Huang³

et al. 2004

J. Mater. Res.

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While the dimension of solder bumps keeps shrinking to meet higher performance requirements, the formation of interfacial compounds may be affected more profoundly by the other side of metallization layer due to a smaller bump height. In this study, cross interactions on the formation of intermetallic compounds (IMCs) were investigated in eutectic SnPb, SnAg3.5, SnAg3.8Cu0.7, and SnSb5 solders jointed to Cu/Cr–Cu/Ti on the chip side and Au/Ni metallization on the substrate side. It is found that the Cu atoms on the chip side diffused to the substrate side to form (Cux,Ni1−x)6Sn5 or (Niy,Cu1−y)3Sn4 for the four solders during the reflow for joining flip chip packages. For the SnPb solder, Au atoms were observed on the chip side after the reflow, yet few Ni atoms were detected on the chip side. In addition, for SnAg3.5 and SnSn5 solders, the Ni atoms on the substrate side migrated to the chip side during the reflow to change binary Cu6Sn5 into ternary (Cux,Ni1−x)6Sn5 IMCs, in which the Ni weighed approximately 21%. Furthermore, it is intriguing that no Ni atoms were detected on the chip side of the SnAg3.8Cu0.7 joint. The possible driving forces responsible for the diffusion of Au, Ni, and Cu atoms are discussed in this paper.

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“…%Ni. [8][9][10][11] It alters the electrochemical behaviour of Cu 6 Sn 5 , opening up the possibility of engineering the anode performance of Liion batteries using ͑Cu, Ni͒ 6 Sn 5 . 12 Additionally, ͑Cu, Ni͒ 6 Sn 5 is the majority intermetallic phase in the reaction layer of solder joints when Sn-Cu-Ni alloys are used as Pb-free solders.…”

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confidence: 99%