Phase equilibria in the In–Sn-rich part of the Cu–In–Sn ternary system

Riani, Paola; Cacciamani, G.; Parodi, Nadia; Borzone, G.; Marazza, R.; Nanni, Francesca; Gusmano, G.

doi:10.1016/j.jallcom.2009.07.129

Cited by 5 publications

(5 citation statements)

References 16 publications

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“…Two main phases, namely, β-In 3 Sn and γ-InSn 4 , are formed in the solder matrices of In-Sn-xCu/Cu joints. The β-(In,Sn) and the γ-(In,Sn) phases are formed through eutectic reactions during cooling from 115 to 113 • C, as discussed in our previous study [20]; these results are consistent with the phase constitutions in the In-Sn phase diagram [52] and other reported results [53]. The (Cu,In,Sn)-IMC formed in the ISC482 and ISC488 alloy matrices (Figure 3f-j) lead to finer microstructures compared to that of the IS48 alloy.…”

Section: Microstructure Evolutionsupporting

confidence: 91%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

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The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

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Section: Microstructure Evolutionsupporting

confidence: 91%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

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“…Shifts in temperature of *20 °C are noticeable with respect to the calculated ones. Discrepancies between calculated and experimental temperatures exist also (though smaller in magnitude) in the assessment of Liu et al [2] Similar remarks were done by Riani et al [9] regarding a shift of ±10 °C particularly in the liquidus temperatures. In Fig.…”

Section: Resultssupporting

confidence: 74%

“…The investigation of Lin et al [8] on the solidification behavior of In-Sn-rich alloys determined the liquidus projection and three ternary reactions with the liquid phase. Lin et al [8] confirm that s 2 -Cu 2 In 3 Sn does not form by primary crystallization and the presented invariant reactions are in agreement with Liu et al [2] On the other hand, research on In-Sn-rich isopleths (at 1.0, 1.5, 2.0 and 2.5 at.% Cu) by Riani et al [9] evidences the formation of s 2 -Cu 2 In 3 Sn in equilibrium with liquid. Moreover, isothermal solidification and growth kinetics studies on soldered Cu/52In48Sn joints revealed only g-(Cu 6 Sn 5 ,Cu 2 In) below 200 °C.…”

Section: Literature Reviewsupporting

confidence: 73%

“…This signal was also observed with higher cooling rates 20 °C/min in preliminary scans performed in this work. Moreover, it was also reported by Riani et al [9] for the Cu2.5In62Sn35.5 alloy at cooling rate of 1 °C/min. These results point to a transition involving stable phases, thus a possible displacement of the boundary between the two s 2 ?…”

Section: Hf-dsc Response With Relation To Equilibrium-based Simulationssupporting

confidence: 71%

“…Liu et al [2] Velikanova et al [7] Lin et al [8] Riani et al [9] (TCSLD) Micrographs in this work were obtained using a scanning electron microscope (SEM) with backscattered electrons (BSE) module. Chemical composition was determined with a SEM-energy dispersive spectroscopy (EDS) and with an electron probe microanalysis Cameca SX Five equipment for wavelength dispersive spectroscopy (WDS).…”

Section: Invariant Reaction Tdb Used In This Workmentioning

confidence: 99%

See 2 more Smart Citations

Multiphase Characterization of Cu-In-Sn Alloys with 17 at.% Cu and Comparison with Calculated Phase Equilibria

Negro

Carrascal

Fries³

et al. 2017

J. Phase Equilib. Diffus.

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Cu-In-Sn alloys are among the suggested materials to replace Pb-Sn alloys traditionally used in joining processes by the electronic industry. Thorough thermodynamic understanding is required for the selection/design of adequate and efficient alloys for specific applications. Understanding the effects that high cost elements such as In have on microstructure and phase stability is imperative for industrial use. In this work ternary alloys were prepared by melting high purity elements (5N) for selected compositions of the 17 at.% Cu isopleth, and cooling down to reproduce process conditions. Chemical composition was determined using scanning electron microscopy equipped with electron probe microanalysis. Measurements of transition temperatures were done by heat-flux differential scanning calorimetry. We present a comprehensive comparison between our experimental results and phase diagram calculations using Liu et al. (J Electron Mater 30:1093, 2001) thermodynamic description based in the CALPHAD method, available in the literature.

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Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Han

Shen

et al. 2021

Materials Science and Engineering: A

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Phase equilibria in the In–Sn-rich part of the Cu–In–Sn ternary system

Cited by 5 publications

References 16 publications

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Multiphase Characterization of Cu-In-Sn Alloys with 17 at.% Cu and Comparison with Calculated Phase Equilibria

Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

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