Phase equilibria of the Al–Ni–Zn system at 340°C

Xu, Honghui; Du, Yong; Zhou, Yue; Zheng, Xuejun; Liu, Shuhong; Su, Xuping; Yin, Fei

doi:10.3139/146.101678

Cited by 11 publications

(2 citation statements)

References 10 publications

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“…This result is similar to the results of a study on the phase equilibria in the Al-Ni-Zn system at 340°C. 20 In that study, the maximum ternary solubility was 11.5 at.% Al in b1 and 1.5 at.% Al in c.…”

Section: Ternary Solubility In Unary and Binary Phasesmentioning

confidence: 96%

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Chang

Seo

Lee

2010

Journal of Elec Materi

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In the electronic packaging field, the Sn-Zn alloy system has been recommended as a high-temperature Pb-free solder. There is a need for thermodynamic data on the Sn-Ni-Zn ternary system. Such data would serve as a basis for understanding the interfacial reaction between Sn-Zn high-temperature solder and Ni substrates and for thermodynamically evaluating the proper composition level of Ni and Zn in Sn-based solder. This study has investigated the phase equilibria of the Sn-Ni-Zn ternary system at 800°C, 500°C, and 200°C (for Ni composition of less than 60 at.%). Scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron probe microanalysis (EPMA) were used to identify the equilibrium phases. On the basis of the experimental data and thermodynamic parameters, the isothermal sections of the Sn-Ni-Zn ternary system have been described, considering the ternary solubility in the binary phases and newfound ternary phases s1 (Sn 3 Ni 4 Zn 3 ) and s2 (Sn 4 Ni 4 Zn 2 ).

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Section: Ternary Solubility In Unary and Binary Phasesmentioning

confidence: 96%

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Chang

Seo

Lee

2010

Journal of Elec Materi

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“…Therefore, the low Cu content possibly inhibited the formation of CuZn IMCs. According to the EDS point results in Table 5, the inner layer (P2 in Figure 6a) adjacent to the Ni coating was identified as Ni 3 Zn 14 IMCs based on the Ni-Zn phase diagram [48]. The outermost layer was a black zigzag phase (P5 in Figure 6a), and it contained 46.94 at.% Al, 29.89 at.% Ni, 20.92 at.% Zn, and 2.25 at.% Cu.…”

Section: Interfacial Microstructure Of the Joint With Ni Coatingmentioning

confidence: 99%

Effects of Different Types of Interlayers on the Interfacial Reaction Mechanism at the Cu Side of Al/Cu Lap Joints Obtained by Laser Welding/Brazing

et al. 2021

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The influence of tin foil and Ni coatings on microstructures, mechanical properties, and the interfacial reaction mechanism was investigated during laser welding/brazing of Al/Cu lap joints. In the presence of a Zn-based filler, tin foil as well as Ni coating strengthened the Al/Cu joints. The tin foil only slightly influenced the joint strength. It considerably improved the spreading/wetting ability of the weld filler; however, it weakened the bonding between the seam and the Al base metal. The Ni coating considerably strengthened the Al/Cu lap joints; the highest tensile strength was 171 MPa, which was higher by 15.5% than that of a joint without any interlayer. Microstructure analysis revealed that composite layers of Ni3Zn14–(τ2 Zn–Ni–Al ternary phase)–(α-Zn solid solution)–Al3Ni formed at the fusion zone (FZ)/Cu interface. Based on the inferences about the microstructures at the interfaces, thermodynamic results were calculated to analyze the interfacial reaction mechanism. The diffusion of Cu was limited by the Ni coating and the mutual attraction between the Al and Ni atoms. The microstructure comprised Zn, Ni, and Al, and they replaced the brittle Cu–Zn intermetallic compounds, successfully strengthening the bonding of the FZ/Cu interface.

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Development of Zn – Al – x Ni Lead‐Free Solders for High‐Temperature Applications

Mallick

Kabir

Sharif

2019

Harsh Environment Electronics

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Phase equilibria of the Al–Ni–Zn system at 340°C

Cited by 11 publications

References 10 publications

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Effects of Different Types of Interlayers on the Interfacial Reaction Mechanism at the Cu Side of Al/Cu Lap Joints Obtained by Laser Welding/Brazing

Development of Zn – Al – x Ni Lead‐Free Solders for High‐Temperature Applications

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