Phase equilibria of the Sn–Zn–Cu ternary system

Chou, Chin-yi; Chen, Sinn-wen

doi:10.1016/j.actamat.2006.01.014

Cited by 143 publications

(78 citation statements)

References 10 publications

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“…When the Zn concentration is high, the molten solder equilibrates with Cu 5 Zn 8 , and when the Zn concentration is lower, the molten solder equilibrates with CuZn and then finally with Cu 6 Sn 5 at the lowest concentrations. Figure 3 shows the Sn-Zn-Cu isothermal section at 250 C, 17 which is close to the conditions of the current experiment, assuming that Ag plays a minor role in the formation of the Cu-Zn IMCs. According to Fig.…”

Section: Methodsmentioning

confidence: 81%

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Kotadia

Panneerselvam

Mokhtari

et al. 2012

Journal of Applied Physics

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The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0–5% Zn or 0–2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

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Section: Methodsmentioning

confidence: 81%

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Kotadia

Panneerselvam

Mokhtari

et al. 2012

Journal of Applied Physics

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“…To improve the mechanical and physical properties of the Sn-Zn alloys, Ag and Cu were added [5][6][7][14][15][16], and also a small amount of Al would be added to one of the alloys [17][18][19][20] to determine whether its addition would improve the ductility. Figure 1 presents the results of the DSC analysis of SnZn0.5Ag1.0Cu and SnZn1.0Ag1.0Cu0.1Al alloys.The figure shows a distinct peak close to the melting temperature of eutectic Sn-Zn alloys (199°C) [22].…”

Section: Resultsmentioning

confidence: 99%

“…Additionally, this alloy's lower cost per mass unit compared to that of SAC solders meets the low-cost demand of the electronics industry. However, because of the corrosion of Zn [3] and low wear resistance [4], Sn-Zn alloys are often modified with alloying additions, such as Ag [5][6][7], Al [4,8,9], Bi [10], In [11,12], Ga [13] and Cu [14,15]. For the Sn9Zn (wt.%)-based alloys with Ag additions were found to be suitable for the soldering of Cu and Al [16].…”

Section: Introductionmentioning

confidence: 99%

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu

Gancarz¹,

Pstruś²

2015

Archives of Metallurgy and Materials

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CharaCterIstICs of sn-Zn Cast alloys wIth the addItIon of ag and Cu Charakterystyka odlanyCh stopów sn-Zn Z dodatkIem ag I CuThe aim of this work was to study the effects of Ag and Cu on the thermal properties and microstructure of Sn-Zn-AgCu cast alloys. Solders based on eutectic Sn-Zn containing 0.5 to 1.0 at.% of Ag and Cu were developed for wave soldering. DSC measurements were performed to determine the melting temperatures of the alloys. TMA and electrical resistivity measurements were performed between -50 and 150°C and between 30 and 150°C, respectively. Small precipitates of Cu5Zn8, CuZn4, and AgZn3 were observed in the microstructures, and their presence was confirmed by XRD measurements. The inclusion of Ag and Cu improved the electrical resistivity and increased the melting temperature, as well as the CTE, of the alloys. However, tests performed to measure the mechanical properties of the alloys demonstratedthat the addition of Ag and Cu caused the mechanical properties to decrease.Keywords: Sn-Zn-Ag-Cu, CTE, electrical resistivity, lead-free solders, XRD, microstructure of cast alloysCelem pracy było zbadanie wpływu dodatku Ag i Cu na właściwości termiczne i mikrostrukturę stopów sn-ZnAg-Cu. stopy lutownicze na bazie eutektyki sn-Zn zawierające od 0,5 do 1,0 % at. Ag oraz Cu zostały opracowane do lutowania falowego. Pomiary DsC wykonywano w celu określenia temperatury topnienia stopów. Badania współczynnika rozszerzalności liniowej przeprowadzono w temperaturach -50 i 150 °C, a oporu elektrycznego od 30 do 150 °C. W mikrostrukturze zaobserwowano drobne wydzielenia Cu5Zn8, CuZn4 i AgZn3, a ich obecność potwierdzono pomiarami XrD. Dodatek Ag i Cu do eutektyki snZn obniża rezystywność elektryczną, a podnosi temperaturę topnienia oraz współczynnik rozszerzalności liniowej stopów. Przeprowadzone badania mechaniczne odlanych stopów wykazały, że dodanie Ag oraz Cu spowodowało obniżenie właściwości mechanicznych.

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“…According to this ternary phase diagram no ternary compound is stable [129]. The intermetallic compounds from Cu-Sn and Cu-Zn system is reported.…”

Section: Electrodeposition and Compositional Analyses Of Czt Metmentioning

confidence: 99%

“…Therefore our studies focused on manufacturing Cu-poor metallic layers with varying Zn/Sn ratios. The isothermal section of the Cu-Sn-Zn phase equilibria at 230°C is shown in Figure 3.8 [129].…”

Section: Electrodeposition and Compositional Analyses Of Czt Metmentioning

confidence: 99%

Optimization of Cu2ZnSnS4 Absorber Layers via Sulfurization of Electrodeposited Cu-Zn-Sn Precursors for Photovoltaic Applications

Ünveroğlu¹

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Phase equilibria of the Sn–Zn–Cu ternary system

Cited by 143 publications

References 10 publications

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

Characteristics Of Sn-Zn Cast Alloys With The Addition Of Ag And Cu

Optimization of Cu2ZnSnS4 Absorber Layers via Sulfurization of Electrodeposited Cu-Zn-Sn Precursors for Photovoltaic Applications

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