Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

Lin, Yung-Chi; Duh, Jenq‐Gong

doi:10.1016/j.scriptamat.2006.01.006

Cited by 70 publications

(60 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This "spalling behavior" is similar to the literature data reported by Lin et al and Teo et al [10][11]. EDX analysis confirmed the IMC composition to be FeSn2, as shown in Table 1.…”

Section: Microstructural Evolution Of the Intermetallic Compound Layersupporting

confidence: 88%

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Hsu

Lee

2016

Journal of Electronic Packaging

View full text Add to dashboard Cite

Growth behavior of the intermetallic compound (IMC), FeSn2, was investigated in the liquid Sn/solid Fe reaction couple over the annealing temperatures from 250°C to 400°C. Low carbon steel AISI 1018 was chosen to make Fe samples. The morphology and thickness of the IMC formed between Sn and Fe were examined using scanning electron microscopy (SEM). In addition, energy-dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) were used to confirm that the IMC is FeSn 2. The growth kinetics of FeSn2 was modeled by parabolic law and empirical power law. Based on the models, the growth constants, activation energy and time exponents were established at different annealing temperatures. It was found that the time exponent values obtained by fitting with empirical power law deviate from 0.5, meaning that volume (bulk) diffusion is not the only rate-controlling process in the liquid Sn/solid Fe reaction couple. Also, a variation in the time exponent values is indicative that the growth behavior is correlated with grain size growth and irregular grain morphology at different annealing stages. The results of this research show that AISI 1018 steel can readily react with Sn to form IMC on the interface. This is an essential requirement of soldering action using Sn-rich solders.

show abstract

“…This "spalling behavior" is similar to the literature data reported by Lin et al and Teo et al [10][11]. EDX analysis confirmed the IMC composition to be FeSn2, as shown in Table 1.…”

Section: Microstructural Evolution Of the Intermetallic Compound Layersupporting

confidence: 88%

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Hsu

Lee

2016

Journal of Electronic Packaging

View full text Add to dashboard Cite

show abstract

“…Because Ni 13 Sn 8 P 3 has a higher Sn content than the Ni-Sn-P deposit, it is speculated that transformation of the Ni-Sn-P deposit into the Ni 13 Sn 8 P 3 compound requires Sn supply from the solder, which is similar to the formation of Ni 2 SnP during the Ni-P/Sn-3.5Ag interfacial reaction. 6,[21][22][23][24] On the basis of these arguments, we believe that polycrystalline Ni 13 Sn 8 P 3 is formed by transformation of amorphous Ni-Sn-P metallization with outward diffusion of Ni and inward diffusion of Sn during the soldering reaction.…”

Section: Discussionmentioning

confidence: 99%

Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation

Yang

Balaraju

Huang

et al. 2014

Journal of Elec Materi

View full text Add to dashboard Cite

The voids formed in the Ni 3 P layer during reaction between Sn-based solders and electroless Ni-P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni 3 P phase, an electrolessly plated Ni-Sn-P alloy (6-7 wt.% P and 19-21 wt.% Sn) was developed to replace Ni-P. The interfacial microstructure of electroless Ni-Sn-P/Sn-3.5Ag solder joints was investigated after reflow and solid-state aging. For comparison, the interfacial reaction in electroless Ni-P/Sn-3.5Ag solder joints under the same reflow and aging conditions was studied. It was found that the Ni-Sn-P metallization is consumed much more slowly than the Ni-P metallization during soldering. After prolonged reaction, no Ni 3 P or voids are observed under SEM at the Ni-Sn-P/Sn-3.5Ag interface. Two main intermetallic compounds, Ni 3 Sn 4 and Ni 13 Sn 8 P 3 , are formed during the soldering reaction. The reason for Ni 3 P phase suppression and the overall mechanisms of reaction at the Ni-Sn-P/Sn-3.5Ag interface are discussed.

show abstract

“…20 As previously mentioned, the reactive diffusion between the Sn-base solder and the electroless Ni-P has been experimentally studied by many investigators. [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] According to these studies, the enrichment of P in the Ni-P occurs owing to growth of Ni 3 Sn 4 and causes formation of Ni 3 P in the Ni-P adjacent to Ni 3 Sn 4 . In the case of the experiment by Li et al, 37) diffusion couples composed of electroless Ni-P Fig.…”

Section: Growth Behavior Of Ni 3 Snmentioning

confidence: 99%

“…[18][19][20] The Ni layer electrolessly deposited onto the Cu-base alloy usually contains 5-20 at% of P. The reactive diffusion between the electroless Ni-P layer and the Sn-base solder has been experimentally studied by many researchers. [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] However, a soldering technique has been used in most of these studies. In this technique, a diffusion couple is prepared from a molten Sn-base solder and a (Ni-P)/Cu conductor material at soldering temperatures, and then isothermally annealed at solid-state temperatures.…”

Section: Introductionmentioning

confidence: 99%

Solid-State Reactive Diffusion between Sn and Electroless Ni–P at 473 K

Yamakami

Kajihara

2009

Mater. Trans.

View full text Add to dashboard Cite

Nickel-phosphorus alloys are electrolessly deposited onto Cu-base conductors to suppress formation of Cu-Sn compounds during soldering using Sn-base solders. However, a Ni-Sn compound is produced during soldering, and continuously grows during energization heating at solid-state temperatures. To examine influence of P on the growth behavior of the Ni-Sn compound during energization heating, the kinetics of the solid-state reactive diffusion between Sn and electroless Ni-P alloys was experimentally determined at 473 K in the present study. For the experiment, pure Cu sheets were electrolessly deposited with Ni-P alloys containing 4.6 at%, 18.5 at% and 20.4 at% of P, and then sandwiched between pure Sn plates. Such Sn/(Ni-P)/Cu/(Ni-P)/Sn diffusion couples were isothermally annealed at 473 K for various periods up to 1307 h. During annealing, a layer of Ni 3 Sn 4 is formed along the Sn/(Ni-P) interface in the diffusion couple. The annealing time dependence of the mean thickness of the Ni 3 Sn 4 layer is expressed by a parabolic relationship. The parabolic coefficient slightly increases with increasing P concentration in the Ni-P. Thus, P in the Ni-P lightly accelerates the growth of Ni 3 Sn 4 at the interconnection between the Ni-P and the Sn-base solder. Using the experimentally determined values of the parabolic coefficient, the interdiffusion coefficient in Ni 3 Sn 4 was analytically evaluated by a mathematical model. The acceleration effect of P on the growth of Ni 3 Sn 4 is quantitatively explained by the dependence of the interdiffusion coefficient on the P concentration in the Ni-P.

show abstract

Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

Cited by 70 publications

References 15 publications

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation

Solid-State Reactive Diffusion between Sn and Electroless Ni–P at 473 K

Contact Info

Product

Resources

About

Phase transformation of the phosphorus-rich layer in SnAgCu/Ni–P solder joints

Cited by 70 publications

References 15 publications

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation

Solid-State Reactive Diffusion between Sn and Electroless Ni&ndash;P at 473 K

Contact Info

Product

Resources

About

Solid-State Reactive Diffusion between Sn and Electroless Ni–P at 473 K