Phenomenology of precipitation in copper-20 pct nickel-20 pct manganese

Shapiro, S.; Tyler, Derek E.; Lanam, R. D.

doi:10.1007/bf02644029

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Properties Of Copper-nickel-manganese Alloys1

Introduction1

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1991

2023

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Cited by 18 publications

(2 citation statements)

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“…Representatives of dispersion-hardening alloys on a copper base are, in particular, alloys of the Cu-Ni-Mn system. According to 42,43,44,45 , the highest ability to strengthen during heat treatment is observed for alloys with Cu content of 60 wt. % (the remaining Ni and Mn in the same proportions), in addition the mentioned alloys are characterized by high corrosion resistance.…”

Section: Properties Of Copper-nickel-manganese Alloysmentioning

confidence: 99%

Increasing of Durability of Oil and Gas Centrifugal Pumps Mechanical Seals Using Tungsten-Free Cermets Based on Chromium Carbide

Prysyazhnyuk¹,

Shihab²,

Shlapak³

et al. 2021

Perspective Trajectory of Scientific Research in Technical Sciences

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Section: Properties Of Copper-nickel-manganese Alloysmentioning

confidence: 99%

Increasing of Durability of Oil and Gas Centrifugal Pumps Mechanical Seals Using Tungsten-Free Cermets Based on Chromium Carbide

Prysyazhnyuk¹,

Shihab²,

Shlapak³

et al. 2021

Perspective Trajectory of Scientific Research in Technical Sciences

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“…This alloy are recognized as an age hardening alloy since the discovery of the ordered NiMn phase in grains and grain boundaries [2,3]. Shapiro [4] reported that the aging reactions would occur at 773K and below, which coincided with Cu-Ni-Mn alloy phase diagram.…”

Section: Introductionmentioning

confidence: 96%

Effect of Solution Treatment on Microstructure Evolution and Mechanical Behavior of Cu-20Ni-20Mn Alloy

Xie

Wang

Xie

et al. 2016

MSF

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The influence of solution treatment on microstructure evolution and mechanical behavior of Cu-20Ni-20Mn alloy was investigated by optical microscopy (OM), X-ray diffraction (XRD) and hardness test. The results revealed that both solution temperature and holding time had effect on the grain growth behavior. The grain growth activation energy was determined by grain size of Cu-20Ni-20Mn alloy for different heat treatment temperatures and periods. With increasing temperature of solution treatment, the second phase is gradually dissolved into the Cu-rich matrix, and the lattice parameter of the matrix solution treated at 1173K for 0.5 h was about 3.668 Å. The hardness of the solution-treated alloy was lower than that of hot forging, and the hardness value decreased with the increase of solution temperature, which may be attributed to grain size. The hardening ability, corresponding to the Hall-Petch relationship, decreased linearly with D-1/2.

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