1996
DOI: 10.1016/0921-4526(95)00725-3
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Phonon attenuation in glasses studied by picosecond ultrasonics

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Cited by 18 publications
(6 citation statements)
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“…Namely, we probe the damping of acoustic phonon modes (e.g., picosecond acoustics) in the solid layer upon interaction with the solid/liquid interface. This measurement allows for optical detection of the propagation of acoustic modes through the piezo-optic effect of energy coupling between the solid film and contacting layers ,, and can be applied outside of thin Au films, as demonstrated in various material systems including polymers and other amorphous materials, , semiconductors, and superlattices. , The time-dependent intensity of these picosecond acoustic signals can be described via where A , B , and δ are scaling factors, Γ is the damping due to interfacial energy transfer, T is the period of the pressure front, and the second term, exp­(− t /τ), accounts for the thermal decay rather than the signal associated with the acoustics. Fitting this equation to the picosecond acoustic signal over the first nanosecond provides us with two important variables: the period, T , and damping, Γ, of the acoustic modes.…”
Section: Picosecond Acoustics To Quantify Phonon Transmissionmentioning
confidence: 99%
“…Namely, we probe the damping of acoustic phonon modes (e.g., picosecond acoustics) in the solid layer upon interaction with the solid/liquid interface. This measurement allows for optical detection of the propagation of acoustic modes through the piezo-optic effect of energy coupling between the solid film and contacting layers ,, and can be applied outside of thin Au films, as demonstrated in various material systems including polymers and other amorphous materials, , semiconductors, and superlattices. , The time-dependent intensity of these picosecond acoustic signals can be described via where A , B , and δ are scaling factors, Γ is the damping due to interfacial energy transfer, T is the period of the pressure front, and the second term, exp­(− t /τ), accounts for the thermal decay rather than the signal associated with the acoustics. Fitting this equation to the picosecond acoustic signal over the first nanosecond provides us with two important variables: the period, T , and damping, Γ, of the acoustic modes.…”
Section: Picosecond Acoustics To Quantify Phonon Transmissionmentioning
confidence: 99%
“…Our front-back pump-probe setup was based on the common picosecond ultrasonics approach based on TDBS [24][25][26][27]. Absorption of an optical pump pulse and subsequent rapid thermal expansion launched the longitudinal acoustic wavepacket into the sample.…”
mentioning
confidence: 99%
“…After the sample was assembled, it was transferred to a cryostat, and the sample chamber was immediately evacuated. Our frontback pump-probe setup was based on the common picosecond ultrasonics approach with TDBS detection [24][25][26][27]. …”
mentioning
confidence: 99%
“…Picosecond ultrasonics is a technique, developed in the mid-1980s, in which ultrashort laser pulses are used to generate and detect acoustic waves with very short wavelength, typically in a nanometer range [1]. Established applications of the method include the determination of elastic parameters [2][3][4][5][6][7][8][9], acoustic damping properties [10][11][12][13][14][15], structural properties [16][17][18][19], interface adhesion and coupling [20][21][22][23] and imaging of embedded layers [24][25][26][27][28][29]. Ultrafast acoustic dynamics were studied in metals [6,21,[30][31][32][33][34][35], semiconductors [10,[36][37][38][39], dielectric materials [11,14,16,40] and polymers [41]…”
Section: Introductionmentioning
confidence: 99%
“…Established applications of the method include the determination of elastic parameters [2][3][4][5][6][7][8][9], acoustic damping properties [10][11][12][13][14][15], structural properties [16][17][18][19], interface adhesion and coupling [20][21][22][23] and imaging of embedded layers [24][25][26][27][28][29]. Ultrafast acoustic dynamics were studied in metals [6,21,[30][31][32][33][34][35], semiconductors [10,[36][37][38][39], dielectric materials [11,14,16,40] and polymers [41][42][43][44]. Recent developments have also shown the feasibility to ap...…”
Section: Introductionmentioning
confidence: 99%