“…[41][42][43] Beneficial for copper(I) complexes is their ability to deposit pure copper films at low temperature (Ͻ200°C) usually without addition of any reducing agents. [41] Representatives are copper(I) β-diketonates (for example, [Cu(η 2 -H 2 C=CHSiMe 3 )(hfac)], [44] hfac = 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate; [(R 3 P) 2 Cu(acac)], R = nBu, [6,34,37] OMe, [45] Et, [45] acac = acetylacetonate), alkoxides (i.e., [Cu(OtBu)] 4 [38] ), and carboxylates ([((RO) 3 P) m CuO 2 CCF 3 ], [39] R = Me, Et, CH 2 CF 3 ; m = 1, 2, 3; [(nBu 3 P) m CuO 2 CR], [46] R = Me, CF 3 , Ph, CH=CHPh; m = 1, 2, 3). Commonly, copper(II) complexes are solids and need the addition of reducing agents for the deposition of pure copper films at higher temperature (Ͼ250°C).…”