It is shown, using the example of InAs/InAsSb/InAsSbP heterostructures, that the formation of a curvilinear reflecting surface consisting of hemispherical etch pits on the rear side of a photodiode chip leads to an increase in the quantum efficiency of photodiodes by a factor of 1.5-1.7 in the entire mid IR wave length interval studied (λ = 3-5 μm). For the obtained photodiodes with a cutoff wavelength of 4.8 μm, a photosensitive area of 0.1 mm 2 , and a chip area of 0.9 mm 2 , a monochromatic responsivity at λ = 4.0 μm reached 0.6 A/W, while a dark current at a reverse bias voltage of 0.2 V was within 4-6 A/cm 2 .