2010
DOI: 10.1002/sia.3252
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Photoelectric threshold of silicon wafer surfaces implanted with H, Si and Ar ions

Abstract: The effect of ion implantation on the photoemission spectral yield for native oxide-covered Si(100) wafer surfaces has been studied. Three types of H, Si and Ar atoms were employed for the ion implantation. For one sample the yield curve was measured successively first at 25• C, next after heating to 340• C, and subsequently after cooling to 40 • C. All implanted samples showed the photoemission in the spectral yield with a much enhanced intensity compared to a nonimplanted sample, moreover, more strongly at 3… Show more

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Cited by 2 publications
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“…The electron or charge transfer at real metal surfaces has also been of great importance in fields such as tribology [4,5] and triboelectric energy production methods [6]. In order to characterize real surfaces, we assessed electron emission (EE) occurring during three main processes of friction, sliding metal surfaces with polymer riders, thermal assistance, and photo or optical stimulation, and examined the EE characteristics of real surfaces of metals, semiconductors, and other materials remaining in ambient environments [7][8][9][10][11]. Furthermore, we reported the relationships between the EE from various metal surfaces and the adhesion and chemical reactions [12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…The electron or charge transfer at real metal surfaces has also been of great importance in fields such as tribology [4,5] and triboelectric energy production methods [6]. In order to characterize real surfaces, we assessed electron emission (EE) occurring during three main processes of friction, sliding metal surfaces with polymer riders, thermal assistance, and photo or optical stimulation, and examined the EE characteristics of real surfaces of metals, semiconductors, and other materials remaining in ambient environments [7][8][9][10][11]. Furthermore, we reported the relationships between the EE from various metal surfaces and the adhesion and chemical reactions [12][13][14].…”
Section: Introductionmentioning
confidence: 99%