“…Using Cu deposited onto CdTe films, it can by shown by XPS studies that a simple Cu overlayer is not formed, rather that the Cu, at least in part, diffuses into the substrate, with the formation of metallic Cd residues. [58] This interdiffusion, which is also evident in other investigations, [36,37,59,60] can be enhanced by increasing the substrate temperatures to about 300 8C. It is interesting to note that due to the temperature-activated interdiffusion, a change in the barrier height from the original pinning position of 0.9 eV above the valence-band maximum to a considerably lower value of 0.6 eV is also found, which is evidently related to the formation of Cu x Te y interface phases.…”