2021
DOI: 10.1007/s12633-021-01389-6
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Photoresponsivity, Electrical and Dielectric Properties of GaAs/P-Si Heterojunction-Based Photodiode

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Cited by 3 publications
(4 citation statements)
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“…14a-14e). At low frequencies, the dielectric loss tangent (tanδ) yields relaxation peaks with positive and negative values, from lnf (6-16) tanδ has positive values, and 37,[48][49][50][51][52][53] and the dispersion in the curves of ε′, ε″ and tanδ attributed to the series resistance R s . [54][55][56][57][58] Figures 15a-a′…”
Section: Resultsmentioning
confidence: 99%
“…14a-14e). At low frequencies, the dielectric loss tangent (tanδ) yields relaxation peaks with positive and negative values, from lnf (6-16) tanδ has positive values, and 37,[48][49][50][51][52][53] and the dispersion in the curves of ε′, ε″ and tanδ attributed to the series resistance R s . [54][55][56][57][58] Figures 15a-a′…”
Section: Resultsmentioning
confidence: 99%
“…[23][24][25] The increases of temperature leads to variation of the place of the original dipoles that improve the forte of the state polarized and formerly the values of ε (T). [26][27][28][29] Figure 5 reveals dielectric constant vs voltage at selected temperatures and constant frequencies of PA-GO composite/MnO 2 /Fe 3 O 4 /n-Si. The depicted dielectric constant, ε′, in Figs.…”
mentioning
confidence: 99%
“…[1][2][3][4] Conversely, Copper metallization does not illustrate a similar self-protective result to Al, nevertheless, its main activation energy reduces the EM fail, declined Cu less than (1.5 at%) in Al boosts the reflection of the AlCu composites in the observable range, 4,5 according, approximately the authors endorse maintaining an adequate Cu in the grain limitations to evade exhaustion, and therefore, EM fail. 2,6 A little atom of copper less than 0.5-5 wt% to Al, reduces harms in AlCu interconnections via EM, growing its period. 7,8 Correspondingly, a little aluminum atom is about 1 at% to Cu decreases the corrosion degree numerous orders of the amount given that longer firmness to the material, providing a little surface irregularity afterward a tempering procedure.…”
mentioning
confidence: 99%
“…This is probably described as the presence of a space charge at the grain borders. [6][7][8][11][12][13] Plots 3a-3g reveal Col-Col diagram, which described by Eqs. 4, 5 at dissimilar temperatures and voltages of Au/AlCu/SiO 2 /p-Si/Al.…”
mentioning
confidence: 99%