1993
DOI: 10.1179/imr.1993.38.4.193
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Physical and mechanical properties of the B2 compound NiAl

Abstract: Considerable work has been performed on N iAI over the past three decades, with rapid growth in research on this intermetallic occurring in the past few years because of recent interest in this material for electronic and high temperature structural applications. However, many physical properties and the controlling fracture and deformation mechanisms over certain temperature regimes are still debated. This is due in part to the incomplete characterisation of many of the alloys previously investigated. Fragmen… Show more

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Cited by 725 publications
(99 citation statements)
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“…NiAl intermetallic alloy has many favorable properties, including a high mechanical strength, a low density, a high melting point and a good oxidation resistance at high temperature environment [1][2][3][4][5]. As a result, it is an ideal material for structural applications subject to corrosive and oxidant environments [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…NiAl intermetallic alloy has many favorable properties, including a high mechanical strength, a low density, a high melting point and a good oxidation resistance at high temperature environment [1][2][3][4][5]. As a result, it is an ideal material for structural applications subject to corrosive and oxidant environments [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…5(a) supports this view. It is important to recall that at 750 C the -NiAl phase has little ductility [28] and brittle second phase particles have previously been noted as preferential sites of void nucleation during creep of, for example, duplex stainless steel [29], Nimonic 80A [30] and SiC reinforced aluminium [31].…”
Section: Creep Fracture Of the Bond Coat Samples In The Sp Testmentioning
confidence: 99%
“…Experiments show that alloying with Ti leads to (i) strong solid solution hardening (SSH) effects [5], and (ii) an increase of the creep resistance [7]. However, the estimates show that the parelastic impurity-dislocation interaction is very small (10' 2 eV) in Ti and V; therefore, the sizemisfit mechanism cannot be responsible for alloying effects.…”
Section: Electronic Mechanism Of Impurity-dislocation Interactions Inmentioning
confidence: 93%
“…The impurities were placed in different positions (1)(2)(3)(4)(5)(6)(7)(8) near the <100>{010} edge dislocation core in NiAl ( Fig. 5 (a)), substituting the corresponding Al atom.…”
Section: Electronic Mechanism Of Impurity-dislocation Interactions Inmentioning
confidence: 99%